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XC7K160T-2FFG676I +BOM

FPGA Kintex-7 Family 162240 Cells 28nm Technology 1V 676-Pin BGA

Manufacturer:

XILINX
Mfr.Part #:

XC7K160T-2FFG676I
Datasheet:

XC7K160T-2FFG676I Datasheet (PDF)
Programmabe:

Not Verified
Number Of LABs/CLBs:

12675
Number Of Logic Elements/Cells:

162240
Total RAM Bits:

11980800
EDA/CAD Models:

Request Free CAD Models for XC7K160T-2FFG676I

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XC7K160T-2FFG676I General Description

The XC7K160T-2FFG676I FPGA by Xilinx offers an impressive array of features that make it a versatile and powerful option for a wide range of applications. With 160,000 logic cells, this FPGA is well-equipped to handle complex tasks in industries such as telecommunications, medical imaging, and industrial automation. Its FFG676 package type ensures secure and reliable connections with a 676-pin fine pitch BGA layout

Key Features

Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory. 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering. High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s. High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces. A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors. DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering. Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter. Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs. Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction. Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option. Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.

Specifications

Programmabe	Not Verified	Number of LABs/CLBs	12675
Number of Logic Elements/Cells	162240	Total RAM Bits	11980800
Number of I/O	400	Number of Gates	-
Voltage - Supply	0.97V ~ 1.03V	Mounting Type	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)