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See Technical Specifications

A3P250-QNG132 +BOM

Advanced FPGA technology with a capacity of 250K system gates

Manufacturer:

Microsemi Corporation
Mfr.Part #:

A3P250-QNG132
Datasheet:

A3P250-QNG132 Datasheet (PDF)
Series:

ProASIC3
Programmabe:

Not Verified
Total RAM Bits:

36864
Number Of I/O:

87
EDA/CAD Models:

Request Free CAD Models for A3P250-QNG132

A3P250-QNG132 General Description

The A3P250-QNG132, part of the Actel Fusion family of FPGAs, is a powerful solution with 250,000 system gates and non-volatile flash-based technology. Its 132-pin QFN package offers a compact form factor, ideal for diverse applications such as industrial automation, automotive, and consumer electronics. With its balance of logic capacity and I/O flexibility, this FPGA is well-suited for a wide range of embedded system designs

Key Features

High Capacity
15 k to 1 M System Gates
Up to 144 kbits of True Dual-Port SRAM
Up to 300 User I/Os
Reprogrammable Flash Technology
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
Instant On Level 0 Support
Single-Chip Solution
Retains Programmed Design when Powered Off
High Performance
350 MHz System Performance
3.3 V, 66 MHz 64-Bit PCI†
In-System Programming (ISP) and Security
ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM®-enabled ProASIC®3 devices) via JTAG (IEEE 1532–compliant)†
FlashLock® to Secure FPGA Contents
Low Power
Core Voltage for Low Power
Support for 1.5 V-Only Systems
Low-Impedance Flash Switches
High-Performance Routing Hierarchy
Segmented, Hierarchical Routing and Clock Structure
Advanced I/O
700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V
Bank-Selectable I/O Voltages—up to 4 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and LVCMOS 2.5 V / 5.0 V Input
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and above)
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold Sparing I/Os‡
Programmable Output Slew Rate† and Drive Strength
Weak Pull-Up/-Down
IEEE 1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages across the ProASIC3 Family
Clock Conditioning Circuit (CCC) and PLL†
Six CCC Blocks, One with an Integrated PLL
Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback
Wide Input Frequency Range (1.5 MHz to 350 MHz)
Embedded Memory†
1 kbit of FlashROM User Nonvolatile Memory
SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†
True Dual-Port SRAM (except ×18)
ARM Processor Support in ProASIC3 FPGAs
M1 ProASIC3 Devices—ARM®Cortex™-M1 Soft Processor Available with or without Debug

Specifications

Series	ProASIC3	Programmabe	Not Verified
Total RAM Bits	36864	Number of I/O	87
Number of Gates	250000	Voltage - Supply	1.425V ~ 1.575V
Mounting Type	Surface Mount	Operating Temperature	0°C ~ 85°C (TJ)
Base Product Number	A3P250