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Ultra Low Density FPGAs.
FBGAManufacturer:
MICROCHIP TECHNOLOGY INC
Mfr.Part #:
A3PE3000-2FG484I
Datasheet:
Part Life Cycle Code:
Active
Reach Compliance Code:
compliant
HTS Code:
8542.39.00.01
JESD-30 Code:
S-PBGA-B484
EDA/CAD Models:
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In today's rapidly evolving technological landscape, having a reliable and adaptable FPGA like the A3PE3000-2FG484I is crucial for staying competitive. This FPGA's blend of processing capabilities, security features, and connectivity options makes it a valuable asset for various industries. From ensuring efficient system integration with its ARM Cortex-M3 processor to providing power-efficient standby modes through Flash*Freeze technology, the A3PE3000-2FG484I offers a comprehensive solution for complex design requirements
Part Life Cycle Code | Active | Reach Compliance Code | compliant |
HTS Code | 8542.39.00.01 | JESD-30 Code | S-PBGA-B484 |
JESD-609 Code | e0 | Length | 23 mm |
Moisture Sensitivity Level | 3 | Number of CLBs | 75264 |
Number of Equivalent Gates | 3000000 | Number of Logic Cells | 75264 |
Number of Terminals | 484 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 75264 CLBS, 3000000 GATES |
Packing Method | TRAY | Peak Reflow Temperature (Cel) | 225 |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | Qualification Status | Not Qualified |
Seated Height-Max | 2.44 mm | Supply Voltage-Max | 1.575 V |
Supply Voltage-Min | 1.425 V | Supply Voltage-Nom | 1.5 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | INDUSTRIAL | Terminal Finish | TIN LEAD |
Terminal Form | BALL | Terminal Pitch | 1 mm |
Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | 20 |
Width | 23 mm |
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AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.
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