This website uses cookies. By using this site, you consent to the use of cookies. For more information, please take a look at our Privacy Policy.

Images are for reference only,

See Technical Specifications

A3PE3000-FG484I +BOM

Ultra Low Density FPGAs.

Manufacturer:

MICROCHIP TECHNOLOGY INC
Mfr.Part #:

A3PE3000-FG484I
Datasheet:

A3PE3000-FG484I Datasheet (PDF)
Part Life Cycle Code:

Active
Reach Compliance Code:

compliant
ECCN Code:

3A991.D
HTS Code:

8542.31.00.01
EDA/CAD Models:

Request Free CAD Models for A3PE3000-FG484I

A3PE3000-FG484I General Description

Elevate your projects with the A3PE3000-FG484I, part of the ProASIC3 family known for its high performance and low cost of ownership. This FPGA boasts a system performance of 350 MHz, making it a powerful tool for various applications. Its security features go above and beyond, offering protection from overbuilding and cloning. With exceptional reliability, you can trust this FPGA to deliver consistent performance and safeguard your designs. The small footprint packages and reprogrammability further enhance the versatility of this product

Key Features

1024Kb RAM available
3K logic elements used
Dual 5V power supplies
Military temperature range
Fully static operation

Specifications

Part Life Cycle Code	Active	Reach Compliance Code	compliant
ECCN Code	3A991.D	HTS Code	8542.31.00.01
Factory Lead Time	52 Weeks	Clock Frequency-Max	350 MHz
JESD-30 Code	S-PBGA-B484	JESD-609 Code	e0
Length	23 mm	Moisture Sensitivity Level	3
Number of CLBs	75264	Number of Equivalent Gates	3000000
Number of Inputs	341	Number of Logic Cells	75264
Number of Outputs	341	Number of Terminals	484
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	75264 CLBS, 3000000 GATES	Packing Method	TRAY
Peak Reflow Temperature (Cel)	225	Power Supplies	1.5/3.3 V
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	Qualification Status	Not Qualified
Seated Height-Max	2.44 mm	Supply Voltage-Max	1.575 V
Supply Voltage-Min	1.425 V	Supply Voltage-Nom	1.5 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	INDUSTRIAL	Terminal Finish	TIN LEAD
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	20
Width	23 mm