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A3PE3000-FGG484 +BOM

Description of A3PE3000-FGG484: FPGA with a gate count of 3 million

Manufacturer:

MICROCHIP TECHNOLOGY INC
Mfr.Part #:

A3PE3000-FGG484
Datasheet:

A3PE3000-FGG484 Datasheet (PDF)
Part Life Cycle Code:

Active
Reach Compliance Code:

compliant
ECCN Code:

3A991.D
HTS Code:

8542.31.00.01
EDA/CAD Models:

Request Free CAD Models for A3PE3000-FGG484

A3PE3000-FGG484 General Description

Boasting 3000 logic cells, the A3PE3000-FGG484 FPGA from Microsemi Corporation is designed to handle intricate digital designs with ease. Its 484-ball FBGA package ensures easy integration into electronic systems, while its 331 user I/Os offer flexibility in connecting external components. With a core voltage of 1.2V and support for various I/O standards, this FPGA provides design engineers with the versatility they need to bring their projects to life

Key Features

8MB RAM
128Kb FlashROM
16 PLLs in C
Temperature - Commercial, Industrial, Military

Specifications

Part Life Cycle Code	Active	Reach Compliance Code	compliant
ECCN Code	3A991.D	HTS Code	8542.31.00.01
Factory Lead Time	52 Weeks	Clock Frequency-Max	350 MHz
JESD-30 Code	S-PBGA-B484	JESD-609 Code	e1
Length	23 mm	Moisture Sensitivity Level	3
Number of CLBs	75264	Number of Equivalent Gates	3000000
Number of Inputs	341	Number of Logic Cells	75264
Number of Outputs	341	Number of Terminals	484
Operating Temperature-Max	70 °C	Operating Temperature-Min
Organization	75264 CLBS, 3000000 GATES	Packing Method	TRAY
Peak Reflow Temperature (Cel)	250	Power Supplies	1.5/3.3 V
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	Qualification Status	Not Qualified
Seated Height-Max	2.44 mm	Supply Voltage-Max	1.575 V
Supply Voltage-Min	1.425 V	Supply Voltage-Nom	1.5 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	COMMERCIAL	Terminal Finish	TIN SILVER COPPER
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
Width	23 mm