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See Technical Specifications

CYBT-353027-02 +BOM

Bluetooth Module

Manufacturer:

Infineon Technologies Corporation
Mfr.Part #:

CYBT-353027-02
Datasheet:

CYBT-353027-02 Datasheet (PDF)
RHoS:

yes
PBFree:

yes
HalogenFree:

yes
EDA/CAD Models:

Request Free CAD Models for CYBT-353027-02

CYBT-353027-02 General Description

Infineon’s AIROC CYBT-353027-02 is a fully certified Bluetooth Smart Ready wireless embedded module based on a proven hardware design and Infineon’s AIROC CYW20706 silicon device. This module is ideal for applications requiring an extended temperature operation of up to +105o C. The CYBT-353027-02 includes a royalty-free BLE stack compatible with Bluetooth 5.0 in a 9.0 × 9.0 × 1.75 mm SMT package form-factor, with a PCB Trace antenna. This device is certified to FCC, ISED, MIC, and CE regulations. The CYBT-353027-02 supports peripheral functions (ADC and PWM), UART, I2C, and SPI communication, and a Bluetooth audio interface. This device provides all necessary components required to operate Bluetooth LE and/or BR/EDR communication standards with a Maximum TX output power of +12 dBm for Bluetooth Classic, +9 dBm for Bluetooth Low Energy modes. This highly integrated module is globally certified to support fast time-to-market, helping cutdown the additional time needed for design, development and certification. Infineon’s AIROC CYBT-353027-02 module complies with Bluetooth core specification version 5.0 and has gone through SIG qualification with QDID: 109292 and Declaration ID: D039123 Infineon’s AIROC module CYBT-353027-02 is designed for Bluetooth wideband speech support.