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See Technical Specifications

EP2C35F672C8N +BOM

FPGA Cyclone® II Family 33216 Cells 402.58MHz 90nm Technology 1.2V 672-Pin FBGA

Manufacturer:

Intel
Mfr.Part #:

EP2C35F672C8N
Datasheet:

EP2C35F672C8N Datasheet (PDF)
Part Life Cycle Code:

Active
Reach Compliance Code:

compliant
HTS Code:

8542.39.00.01
Additional Feature:

ALSO REQUIRES 3.3 SUPPLY
EDA/CAD Models:

Request Free CAD Models for EP2C35F672C8N

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EP2C35F672C8N General Description

FPGA, CYCLONE II, 35K LE, 672FBGA; No. of Logic Blocks: 2076; No. of Macrocells: -; FPGA Family: Cyclone II; Logic Case Style: BGA; No. of Pins: 672Pins; No. of Speed Grades: -; Total RAM Bits: 483840Kbit; No. of I/O's: 475I/O's; Clock Management: -; Core Supply Voltage Min: 1.15V; Core Supply Voltage Max: 1.25V; I/O Supply Voltage: 3.3V; Operating Frequency Max: 320MHz; Product Range: -; MSL: MSL 3 - 168 hours; SVHC: No SVHC (17-Dec-2015); Core Supply Voltage Range: 1.15V to 1.25V; I/O Interface Standard: Differential HSTL, LVDS, LVPECL, mini-LVDS, RSDS; Logic Function Number: EP2C35F672; Logic IC Base Number: 2; Logic IC Function: FPGA; Operating Temperature Max: 85°C; Operating Temperature Min: 0°C; Operating Temperature Range: 0°C to +85°C; Programmable Logic Type: FPGA; Termination Type: Surface Mount Device

Specifications

Part Life Cycle Code	Active	Reach Compliance Code	compliant
HTS Code	8542.39.00.01	Additional Feature	ALSO REQUIRES 3.3 SUPPLY
Clock Frequency-Max	402.5 MHz	JESD-30 Code	S-PBGA-B672
JESD-609 Code	e1	Length	27 mm
Moisture Sensitivity Level	3	Number of CLBs	2076
Number of Inputs	475	Number of Logic Cells	33216
Number of Outputs	459	Number of Terminals	672
Operating Temperature-Max	85 °C	Operating Temperature-Min
Organization	2076 CLBS	Peak Reflow Temperature (Cel)	260
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	Qualification Status	Not Qualified
Seated Height-Max	2.6 mm	Supply Voltage-Max	1.25 V
Supply Voltage-Min	1.15 V	Supply Voltage-Nom	1.2 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	OTHER	Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
Width	27 mm