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See Technical Specifications

EP4CE30F23I7N +BOM

2003 RoHS Compliant BALL Active FPGA 100C 74.3kB 200MHz 1.24V

Manufacturer:

Intel
Mfr.Part #:

EP4CE30F23I7N
Datasheet:

EP4CE30F23I7N Datasheet (PDF)
Programmabe:

Not Verified
Number Of LABs/CLBs:

1803
Number Of Logic Elements/Cells:

28848
Total RAM Bits:

608256
EDA/CAD Models:

Request Free CAD Models for EP4CE30F23I7N

EP4CE30F23I7N General Description

Featuring essential components such as PLLs, an on-chip oscillator, and a JTAG interface for programming and debugging, the EP4CE30F23I7N FPGA streamlines the development process and ensures smooth integration within diverse electronic systems. Its 344,640 bits of total RAM and maximum of 87,696 logic elements per LAB enable efficient data processing and storage, making it ideal for demanding applications in fields such as industrial automation, communications equipment, and automotive systems

Key Features

Low-cost, low-power FPGA fabric: 6K to 150K logic elements Up to 6.3 Mb of embedded memory Up to 360 18 × 18 multipliers for DSP processing intensive applications Protocol bridging applications for under 1.5 W total power Cyclone IV GX devices offer up to eight high-speed transceivers that provide: Data rates up to 3.125 Gbps 8B/10B encoder/decoder 8-bit or 10-bit physical media attachment (PMA) to physical coding sublayer (PCS) interface Byte serializer/deserializer (SERDES) Word aligner Rate matching FIFO TX bit slipper for Common Public Radio Interface (CPRI) Electrical idle Dynamic channel reconfiguration allowing you to change data rates andprotocols on-the-flyStatic equalization and pre-emphasis for superior signal integrity 150 mW per channel power consumption Flexible clocking structure to support multiple protocols in a single transceiver block Cyclone IV GX devices offer dedicated hard IP for PCI Express (PIPE) (PCIe) Gen 1: ×1, ×2, and ×4 lane configurations End-point and root-port configurations Up to 256-byte payload One virtual channel 2 KB retry buffer 4 KB receiver (Rx) buffer Cyclone IV GX devices offer a wide range of protocol support: PCIe (PIPE) Gen 1 ×1, ×2, and ×4 (2.5 Gbps) Gigabit Ethernet (1.25 Gbps) CPRI (up to 3.072 Gbps) XAUI (3.125 Gbps) Triple rate serial digital interface (SDI) (up to 2.97 Gbps) Serial RapidIO (3.125 Gbps) Basic mode (up to 3.125 Gbps) V-by-One (up to 3.0 Gbps) DisplayPort (2.7 Gbps) Serial Advanced Technology Attachment (SATA) (up to 3.0 Gbps) OBSAI (up to 3.072 Gbps) Up to 532 user I/Os LVDS interfaces up to 840 Mbps transmitter (Tx), 875 Mbps Rx Support for DDR2 SDRAM interfaces up to 200 MHz Support for QDRII SRAM and DDR SDRAM up to 167 MHz Up to eight phase-locked loops (PLLs) per device Offered in commercial and industrial temperature grades

Specifications

Programmabe	Not Verified	Number of LABs/CLBs	1803
Number of Logic Elements/Cells	28848	Total RAM Bits	608256
Number of I/O	328	Number of Gates	-
Voltage - Supply	1.15V ~ 1.25V	Mounting Type	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)