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See Technical Specifications

MC9S08GT16ACFBE +BOM

Versatile Embedded System Solution

Manufacturer:

NXP
Mfr.Part #:

MC9S08GT16ACFBE
Datasheet:

MC9S08GT16ACFBE Datasheet (PDF)
Part Life Cycle Code:

Active
Reach Compliance Code:

compliant
ECCN Code:

EAR99
HTS Code:

8542.31.00.01
EDA/CAD Models:

Request Free CAD Models for MC9S08GT16ACFBE

MC9S08GT16ACFBE General Description

Additionally, MC9S08GT16ACFBE has a Level-3 Moisture Sensitivity Level (MSL) and is packaged in trays for convenient handling during manufacturing. Its compact dimensions of 10mm x 10mm x 2mm and maximum reflow temperature of 260°C further enhance its usability in space-constrained applications

Key Features

Microcontroller with advanced features and performance
Low power consumption and high reliability
Faster development and prototyping

Application

High performance chip
Low power consumption

Specifications

Source Content uid	MC9S08GT16ACFBE	Part Life Cycle Code	Active
Reach Compliance Code	compliant	ECCN Code	EAR99
HTS Code	8542.31.00.01	Factory Lead Time	52 Weeks
Has ADC	YES	Address Bus Width
Bit Size	16	DAC Channels	NO
DMA Channels	NO	External Data Bus Width
JESD-30 Code	S-PQFP-G44	Moisture Sensitivity Level	3
Number of I/O Lines	36	Number of Terminals	44
PWM Channels	YES	Peak Reflow Temperature (Cel)	260
Surface Mount	YES	Technology	CMOS
Temperature Grade	INDUSTRIAL	Terminal Finish	TIN
Terminal Form	GULL WING	Terminal Position	QUAD
Time@Peak Reflow Temperature-Max (s)	40	uPs/uCs/Peripheral ICs Type	MICROCONTROLLER