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PC123Y23J00F +BOM

Boost system reliability and efficiency with this robust, pin PDIP design

Key Features

  • 1. 4-pin DIP package
  • 2. Double transfer mold package (Ideal for Flow Soldering)
  • 3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V)
  • 4. Several CTR ranks available
  • 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm)
  • 6. Long creepage distance type (wide lead-form type only : MIN. 8mm)
  • 7. High isolation voltage between input and output (Viso(rms) : 5.0 kV)

Specifications

Product Category IC Chips

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AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.

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In Stock: 6,327

Minimum Order: 1

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