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See Technical Specifications

R5F572NNDDFC#30 +BOM

LQFP-176 Package Size of 24x24mm

Manufacturer:

Renesas Electronics Corporation
Mfr.Part #:

R5F572NNDDFC#30
Datasheet:

R5F572NNDDFC#30 Datasheet (PDF)
Series:

RX700
Programmabe:

Not Verified
Core Processor:

RXv3
Core Size:

32-Bit Single-Core
EDA/CAD Models:

Request Free CAD Models for R5F572NNDDFC#30

R5F572NNDDFC#30 General Description

With its robust feature set and reliable performance, the R5F572NNDDFC#30 emerges as a go-to choice for applications that prioritize top-notch quality and seamless operation. Whether it's for developing cutting-edge automotive technologies, streamlining industrial processes, or enhancing user experiences in consumer electronics, this MCU delivers on all fronts. By seamlessly blending power efficiency with high performance and advanced security measures, the R5F572NNDDFC#30 cements its status as a versatile and dependable option for a wide range of embedded systems designs

Key Features

This microcontroller offers a rich set of peripherals and interfaces
Enabling complex industrial control systems with ease
Providing a high degree of flexibility and customization options

Specifications

Series	RX700	Programmabe	Not Verified
Core Processor	RXv3	Core Size	32-Bit Single-Core
Speed	240MHz	Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals	DMA, LCD, LVD, POR, PWM, WDT	Number of I/O	136
Program Memory Size	4MB (4M x 8)	Program Memory Type	FLASH
EEPROM Size	32K x 8	RAM Size	1M x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 3.6V	Data Converters	A/D 8x12b, 21x12b; D/A 2x12b
Oscillator Type	Internal	Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount	Base Product Number	R5F572