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TC3567CFSG-002(E1C +BOM

Enable efficient communication with our low-power, highly integrated RF solution

TC3567CFSG-002(E1C General Description

  • Feature:Ultra-low power / LE single / User Flash / Scatternet support / Standalone mode support / Small QFN package / LE Data Length Extension support / LE Secure Connection supoort
  • Automotive Support:N/A
  • Bluetooth Category:Bluetooth® low energy
  • Bluetooth Core spec.:4.2
  • Embedded Profiles:GATT / SMP
  • Interfacing:I2C / SPI / UART / PWM / ADC / SWD
  • User RAM Size (KB):51
  • User Flash Size (KB):128
  • Function:ARM® Cortex®-M0 / 50ohm impedance for RF IO / DC-DC converter / low power mode(4 level)
  • Other Functions:LE data length extension / LE secure connection / Scatternet / Random Number Generator
  • RoHS Compatible Product(s) (#):Available
  • Assembly bases:Taiwan
  • Status:Under mass production

Toshiba Semiconductor Inventory

Key Features

  • Status:85 ℃
  • Status:-40 ℃
  • Status:3.6 V
  • Status:1.9 V
  • Status:3.3 mA
  • Status:3.3 mA
  • Status:2.5 μA
  • Status:0.05 μA
  • Status:0 dBm
  • Status:-93.5 dBm
Toshiba Semiconductor Original Stock

Specifications

feature-packaging Tape and Reel feature-pin-count 40
feature-cecc-qualified feature-esd-protection
feature-military No feature-aec-qualified No
feature-auto-motive No feature-p-pap No
feature-eccn-code feature-svhc
feature-svhc-exceeds-threshold

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AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.

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