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XC2S300E-6FTG256C +BOM

Programmable logic device

XC2S300E-6FTG256C General Description

Xilinx's XC2S300E-6FTG256C, part of the Spartan-II family, is an FPGA designed to provide high-speed performance and flexibility for a variety of digital system implementations. With a capacity of 300,000 system gates and a speed grade of -6, it offers programmable logic cells, configurable I/Os, embedded RAM, and built-in features for system integration. The FTG256C package with 256 pins ensures reliable connectivity and integration, making it suitable for applications such as industrial control, automotive electronics, telecommunications, and consumer electronics. Fabricated using advanced semiconductor manufacturing processes, this FPGA promises high performance and reliability. It is widely available for purchase from Xilinx and authorized distributors, providing designers with a versatile and reliable platform for implementing complex digital systems

Specifications

Pbfree Code Yes Part Life Cycle Code Obsolete
Pin Count 256 Reach Compliance Code
ECCN Code EAR99 HTS Code 8542.39.00.01
Additional Feature MAXIMUM USABLE GATES = 300000 Clock Frequency-Max 357 MHz
Combinatorial Delay of a CLB-Max 0.47 ns JESD-30 Code S-PBGA-B256
JESD-609 Code e1 Length 17 mm
Moisture Sensitivity Level 3 Number of CLBs 1536
Number of Equivalent Gates 93000 Number of Inputs 329
Number of Logic Cells 6912 Number of Outputs 329
Number of Terminals 256 Operating Temperature-Max 85 °C
Operating Temperature-Min Organization 1536 CLBS, 93000 GATES
Peak Reflow Temperature (Cel) 260 Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Seated Height-Max 2 mm
Supply Voltage-Max 1.89 V Supply Voltage-Min 1.71 V
Supply Voltage-Nom 1.8 V Surface Mount YES
Technology CMOS Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Terminal Form BALL
Terminal Pitch 1 mm Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 Width 17 mm

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