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Programmable logic device
256-FTBGA (17x17)Manufacturer:
Mfr.Part #:
XC2S300E-6FTG256C
Datasheet:
Pbfree Code:
Yes
Part Life Cycle Code:
Obsolete
Pin Count:
256
ECCN Code:
EAR99
EDA/CAD Models:
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Xilinx's XC2S300E-6FTG256C, part of the Spartan-II family, is an FPGA designed to provide high-speed performance and flexibility for a variety of digital system implementations. With a capacity of 300,000 system gates and a speed grade of -6, it offers programmable logic cells, configurable I/Os, embedded RAM, and built-in features for system integration. The FTG256C package with 256 pins ensures reliable connectivity and integration, making it suitable for applications such as industrial control, automotive electronics, telecommunications, and consumer electronics. Fabricated using advanced semiconductor manufacturing processes, this FPGA promises high performance and reliability. It is widely available for purchase from Xilinx and authorized distributors, providing designers with a versatile and reliable platform for implementing complex digital systems
Pbfree Code | Yes | Part Life Cycle Code | Obsolete |
Pin Count | 256 | Reach Compliance Code | |
ECCN Code | EAR99 | HTS Code | 8542.39.00.01 |
Additional Feature | MAXIMUM USABLE GATES = 300000 | Clock Frequency-Max | 357 MHz |
Combinatorial Delay of a CLB-Max | 0.47 ns | JESD-30 Code | S-PBGA-B256 |
JESD-609 Code | e1 | Length | 17 mm |
Moisture Sensitivity Level | 3 | Number of CLBs | 1536 |
Number of Equivalent Gates | 93000 | Number of Inputs | 329 |
Number of Logic Cells | 6912 | Number of Outputs | 329 |
Number of Terminals | 256 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | Organization | 1536 CLBS, 93000 GATES | |
Peak Reflow Temperature (Cel) | 260 | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Qualification Status | Not Qualified | Seated Height-Max | 2 mm |
Supply Voltage-Max | 1.89 V | Supply Voltage-Min | 1.71 V |
Supply Voltage-Nom | 1.8 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | OTHER |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 | Width | 17 mm |
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