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See Technical Specifications

XC2V1000-4FG256I +BOM

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Manufacturer:

XILINX
Mfr.Part #:

XC2V1000-4FG256I
Datasheet:

XC2V1000-4FG256I Datasheet (PDF)
Pbfree Code:

No
Part Life Cycle Code:

Obsolete
Pin Count:

256
Reach Compliance Code:

not_compliant
EDA/CAD Models:

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XC2V1000-4FG256I General Description

Featuring 96 Block RAM/FIFO (18 Kb each), this device offers ample storage for data-intensive tasks without compromising on speed. The 256-pin Fine-Pitch Ball Grid Array (FBGA) package provides high-density design capabilities while supporting various I/O standards, including LVDS, LVTTL, and HSTL. This versatility makes the XC2V1000-4FG256I suitable for a wide range of interface requirements

Specifications

Pbfree Code	No	Part Life Cycle Code	Obsolete
Pin Count	256	Reach Compliance Code	not_compliant
ECCN Code	EAR99	HTS Code	8542.39.00.01
Clock Frequency-Max	650 MHz	Combinatorial Delay of a CLB-Max	0.44 ns
JESD-30 Code	S-PBGA-B256	JESD-609 Code	e0
Length	17 mm	Moisture Sensitivity Level	3
Number of CLBs	1280	Number of Equivalent Gates	1000000
Number of Inputs	172	Number of Logic Cells	11520
Number of Outputs	172	Number of Terminals	256
Organization	1280 CLBS, 1000000 GATES	Peak Reflow Temperature (Cel)	225
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	Qualification Status	Not Qualified
Seated Height-Max	2 mm	Supply Voltage-Max	1.575 V
Supply Voltage-Min	1.425 V	Supply Voltage-Nom	1.5 V
Surface Mount	YES	Technology	CMOS
Terminal Finish	Tin/Lead (Sn63Pb37)	Terminal Form	BALL
Terminal Pitch	1 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	Width	17 mm