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See Technical Specifications

XC2V3000-4FG676I +BOM

The 676-Pin FBGA package provides a compact and efficient form factor for the XC2V3000-4FG676I

Manufacturer:

XILINX
Mfr.Part #:

XC2V3000-4FG676I
Datasheet:

XC2V3000-4FG676I Datasheet (PDF)
Pbfree Code:

No
Part Life Cycle Code:

Obsolete
Pin Count:

676
Reach Compliance Code:

not_compliant

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

XC2V3000-4FG676I General Description

The XC2V3000-4FG676I FPGA by Xilinx is a powerful and versatile device designed for a wide range of applications across various industries. With its impressive 3 million logic cells and 676 I/O pins, this FPGA provides users with ample resources to implement complex digital circuits with ease. Its configurable Block RAM memory and Virtex-II Pro platform architecture ensure high performance and reliability, making it suitable for both prototyping and production environments

Specifications

Pbfree Code	No	Part Life Cycle Code	Obsolete
Pin Count	676	Reach Compliance Code	not_compliant
ECCN Code	3A991.D	HTS Code	8542.39.00.01
Factory Lead Time	4 Weeks	Clock Frequency-Max	650 MHz
Combinatorial Delay of a CLB-Max	0.44 ns	JESD-30 Code	S-PBGA-B676
JESD-609 Code	e0	Length	27 mm
Moisture Sensitivity Level	3	Number of CLBs	3584
Number of Equivalent Gates	3000000	Number of Inputs	484
Number of Logic Cells	32256	Number of Outputs	484
Number of Terminals	676	Organization	3584 CLBS, 3000000 GATES
Peak Reflow Temperature (Cel)	225	Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Seated Height-Max	2.6 mm
Supply Voltage-Max	1.575 V	Supply Voltage-Min	1.425 V
Supply Voltage-Nom	1.5 V	Surface Mount	YES
Technology	CMOS	Terminal Finish	Tin/Lead (Sn63Pb37)
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
Width	27 mm