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See Technical Specifications

XC4VFX12-10SFG363C +BOM

Field Programmable Gate Array XC4VFX12-10SFG363C

Manufacturer:

XILINX
Mfr.Part #:

XC4VFX12-10SFG363C
Datasheet:

XC4VFX12-10SFG363C Datasheet (PDF)
Pbfree Code:

Yes
Part Life Cycle Code:

Transferred
Pin Count:

363
Reach Compliance Code:

not_compliant

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

XC4VFX12-10SFG363C General Description

The XC4VFX12-10SFG363C is a top-of-the-line FPGA from Xilinx, tailored for high-performance applications that demand intricate digital logic functions and exceptional signal processing capabilities. Boasting 12,288 logic cells and 174,080 system gates, this Virtex-4 FX series device delivers unmatched processing power. The FPGA offers a maximum clock frequency of 388 MHz, thanks to its -10 speed grade, and comes equipped with 640 configurable I/O pins supporting various interface standards such as LVDS, LVTTL, HSTL, and SSTL. Additionally, with 64 dedicated block RAM modules providing a total of 1,048,576 bits of storage, the XC4VFX12-10SFG363C is primed to handle complex data processing tasks with ease. Furthermore, its flexibility is underscored by its support for both serial and parallel programming modes

Specifications

Pbfree Code	Yes	Part Life Cycle Code	Transferred
Pin Count	363	Reach Compliance Code	not_compliant
ECCN Code	3A991.D	HTS Code	8542.39.00.01
Factory Lead Time	12 Weeks	Clock Frequency-Max	1028 MHz
JESD-30 Code	S-PBGA-B363	JESD-609 Code	e1
Length	17 mm	Moisture Sensitivity Level	4
Number of CLBs	1368	Number of Inputs	240
Number of Logic Cells	12312	Number of Outputs	240
Number of Terminals	363	Operating Temperature-Max	85 °C
Operating Temperature-Min		Organization	1368 CLBS
Peak Reflow Temperature (Cel)	260	Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Seated Height-Max	1.99 mm
Supply Voltage-Max	1.26 V	Supply Voltage-Min	1.14 V
Supply Voltage-Nom	1.2 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	OTHER
Terminal Finish	TIN SILVER COPPER	Terminal Form	BALL
Terminal Pitch	0.8 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	Width	17 mm