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See Technical Specifications

XC5VLX30-1FFG324I +BOM

Versatile and powerful FPGA solution with 2400 CLBs and 30720 cells

Manufacturer:

XILINX
Mfr.Part #:

XC5VLX30-1FFG324I
Datasheet:

XC5VLX30-1FFG324I Datasheet (PDF)
Pbfree Code:

Yes
Part Life Cycle Code:

Transferred
Pin Count:

324
Reach Compliance Code:

not_compliant
EDA/CAD Models:

Request Free CAD Models for XC5VLX30-1FFG324I

Email: [email protected]

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Tel: +852 95804164

XC5VLX30-1FFG324I General Description

In terms of connectivity, the XC5VLX30-1FFG324I does not disappoint. Sporting a 324-pin BGA package, it provides a compact footprint of 23x23 mm. The FPGA offers a diverse range of connectivity options, including configurable I/O standards and dedicated high-speed transceivers. Moreover, support for communication protocols like PCI Express, Ethernet, and SATA makes it adaptable to a variety of interfaces

Specifications

Pbfree Code	Yes	Part Life Cycle Code	Transferred
Pin Count	324	Reach Compliance Code	not_compliant
ECCN Code	3A991.D	HTS Code	8542.39.00.01
Factory Lead Time	72 Weeks	Combinatorial Delay of a CLB-Max	0.9 ns
JESD-30 Code	S-PBGA-B324	JESD-609 Code	e1
Length	19 mm	Moisture Sensitivity Level	4
Number of CLBs	2400	Number of Inputs	220
Number of Logic Cells	30720	Number of Outputs	220
Number of Terminals	324	Operating Temperature-Max	100 °C
Operating Temperature-Min	-40 °C	Organization	2400 CLBS
Peak Reflow Temperature (Cel)	250	Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Seated Height-Max	2.85 mm
Supply Voltage-Max	1.05 V	Supply Voltage-Min	0.95 V
Supply Voltage-Nom	1 V	Surface Mount	YES
Temperature Grade	INDUSTRIAL	Terminal Finish	TIN SILVER COPPER
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
Width	19 mm