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See Technical Specifications

XC5VLX30-1FFG676I +BOM

BGA package with 676 pins

Manufacturer:

XILINX
Mfr.Part #:

XC5VLX30-1FFG676I
Datasheet:

XC5VLX30-1FFG676I Datasheet (PDF)
Pbfree Code:

Yes
Part Life Cycle Code:

Transferred
Pin Count:

676
Reach Compliance Code:

not_compliant

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

XC5VLX30-1FFG676I General Description

The XC5VLX30-1FFG676I is a powerful member of the Virtex-5 family of FPGAs from Xilinx. With 30,000 logic cells and a 65nm process technology, it offers high performance and versatility for a variety of applications. The 676-pin flip-chip fine-pitch ball grid array package makes it suitable for surface-mount assembly, and the industrial temperature range grade ensures reliable operation in harsh environmental conditions. Whether in telecommunications, aerospace, defense, or industrial automation, the XC5VLX30-1FFG676I is a reliable choice for demanding applications

Specifications

Pbfree Code	Yes	Part Life Cycle Code	Transferred
Pin Count	676	Reach Compliance Code	not_compliant
ECCN Code	3A991.D	HTS Code	8542.39.00.01
Factory Lead Time	72 Weeks	Combinatorial Delay of a CLB-Max	0.9 ns
JESD-30 Code	S-PBGA-B676	JESD-609 Code	e1
Length	27 mm	Moisture Sensitivity Level	4
Number of CLBs	2400	Number of Inputs	400
Number of Logic Cells	30720	Number of Outputs	400
Number of Terminals	676	Operating Temperature-Max	100 °C
Operating Temperature-Min	-40 °C	Organization	2400 CLBS
Peak Reflow Temperature (Cel)	250	Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Seated Height-Max	3 mm
Supply Voltage-Max	1.05 V	Supply Voltage-Min	0.95 V
Supply Voltage-Nom	1 V	Surface Mount	YES
Temperature Grade	INDUSTRIAL	Terminal Finish	TIN SILVER COPPER
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
Width	27 mm