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XC5VLX30T-1FFG323I +BOM

Lead-free FBGA-323 FPGA measuring 19 x 19 mm

Manufacturer:

XILINX
Mfr.Part #:

XC5VLX30T-1FFG323I
Datasheet:

XC5VLX30T-1FFG323I Datasheet (PDF)
Part Life Cycle Code:

Transferred
Pin Count:

323
Reach Compliance Code:

not_compliant
ECCN Code:

EAR99
EDA/CAD Models:

Request Free CAD Models for XC5VLX30T-1FFG323I

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XC5VLX30T-1FFG323I General Description

Operating at a maximum frequency of 550 MHz, the XC5VLX30T-1FFG323I offers rapid data processing while consuming only 5.76W of power. Its 90nm CMOS technology ensures efficient performance, housed in a compact 323-pin FineFCSBGA package. The FPGA is equipped with a XCF32P platform flash memory for non-volatile configuration storage, providing reliability and flexibility in configuration

Specifications

Part Life Cycle Code	Transferred	Pin Count	323
Reach Compliance Code	not_compliant	ECCN Code	EAR99
HTS Code	8542.39.00.01	Factory Lead Time	72 Weeks
Combinatorial Delay of a CLB-Max	0.9 ns	JESD-30 Code	S-PBGA-B323
JESD-609 Code	e1	Length	19 mm
Moisture Sensitivity Level	4	Number of CLBs	2400
Number of Inputs	172	Number of Logic Cells	30720
Number of Outputs	172	Number of Terminals	323
Operating Temperature-Max	100 °C	Operating Temperature-Min	-40 °C
Organization	2400 CLBS	Peak Reflow Temperature (Cel)	250
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	Qualification Status	Not Qualified
Seated Height-Max	2.85 mm	Supply Voltage-Max	1.05 V
Supply Voltage-Min	0.95 V	Supply Voltage-Nom	1 V
Surface Mount	YES	Temperature Grade	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER	Terminal Form	BALL
Terminal Pitch	1 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	Width	19 mm