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See Technical Specifications

XC5VLX85-1FF676I +BOM

82944 logic cells

Manufacturer:

XILINX
Mfr.Part #:

XC5VLX85-1FF676I
Datasheet:

XC5VLX85-1FF676I Datasheet (PDF)
Pbfree Code:

No
Part Life Cycle Code:

Transferred
Pin Count:

676
Reach Compliance Code:

not_compliant

XC5VLX85-1FF676I General Description

Meet the XC5VLX85-1FF676I FPGA by Xilinx, a cutting-edge solution for high-performance applications. With an impressive 85,000 logic cells, this FPGA is tailor-made for tasks that demand complex logic processing and efficient performance. Equipped with 1,296 Kb of block RAM and 128 DSP48E slices, the XC5VLX85-1FF676I excels in signal processing, making it an ideal choice for projects that require fast and reliable data handling. Operating at a maximum speed of 550 MHz, this FPGA ensures swift execution of tasks, while the 183 I/O pins enable seamless connectivity with external devices. Packaged in a sturdy 676-pin flip-chip ball grid array (FF676), the XC5VLX85-1FF676I is built to last and designed with security in mind. Its built-in self-test capabilities and triple-module redundancy feature add an extra layer of reliability, making it a trusted choice for critical applications where performance and safety are paramount

Specifications

Pbfree Code	No	Part Life Cycle Code	Transferred
Pin Count	676	Reach Compliance Code	not_compliant
ECCN Code	3A991.D	HTS Code	8542.39.00.01
Factory Lead Time	72 Weeks	Combinatorial Delay of a CLB-Max	0.9 ns
JESD-30 Code	S-PBGA-B676	JESD-609 Code	e0
Length	27 mm	Moisture Sensitivity Level	4
Number of CLBs	6480	Number of Inputs	440
Number of Logic Cells	82944	Number of Outputs	440
Number of Terminals	676	Operating Temperature-Max	100 °C
Operating Temperature-Min	-40 °C	Organization	6480 CLBS
Peak Reflow Temperature (Cel)	225	Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Seated Height-Max	3 mm
Supply Voltage-Max	1.05 V	Supply Voltage-Min	0.95 V
Supply Voltage-Nom	1 V	Surface Mount	YES
Temperature Grade	INDUSTRIAL	Terminal Finish	TIN LEAD
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
Width	27 mm