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XC6VLX365T-2FFG1759I +BOM

Programmable Logic Device

XC6VLX365T-2FFG1759I General Description

Meet the XC6VLX365T-2FFG1759I, a field-programmable gate array (FPGA) designed for high-performance industrial applications. Featuring an impressive 365,760 logic cells, 23,760 slices, and 960 DSP slices, this FPGA is engineered to handle demanding tasks with ease. With a maximum operating speed of 550 MHz and 1759 I/O pins, the XC6VLX365T-2FFG1759I delivers exceptional performance, making it an ideal choice for applications where speed and processing power are critical. When it comes to memory, this FPGA doesn't disappoint, offering 1,382 KB of block RAM and 789 KB of distributed RAM, ensuring ample storage for intensive data processing. Its integrated block RAM, enhanced clock management resources, and multiple gigabit transceivers further enhance its data processing capabilities, allowing for fast and efficient performance. Additionally, the XC6VLX365T-2FFG1759I supports a wide range of interfaces, including PCI Express, Ethernet, and DDR3 memory, making it a versatile solution for various applications. Its high-speed serial connectivity options also make interfacing with other devices and systems seamless, further solidifying its position as a reliable and powerful FPGA for industrial use

Specifications

Pbfree Code Yes Part Life Cycle Code Transferred
Pin Count 1759 Reach Compliance Code compliant
ECCN Code 3A001.A.7.A HTS Code 8542.39.00.01
Clock Frequency-Max 1286 MHz Combinatorial Delay of a CLB-Max 4.29 ns
JESD-30 Code S-PBGA-B1759 JESD-609 Code e1
Length 42.5 mm Moisture Sensitivity Level 4
Number of Inputs 720 Number of Logic Cells 364032
Number of Outputs 720 Number of Terminals 1759
Operating Temperature-Max 100 °C Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245 Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Seated Height-Max 3.5 mm
Supply Voltage-Max 1.05 V Supply Voltage-Min 0.95 V
Supply Voltage-Nom 1 V Surface Mount YES
Technology CMOS Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER Terminal Form BALL
Terminal Pitch 1 mm Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 Width 42.5 mm

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