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XC7K325T-2FBG900C +BOM

XC7K325T-2FBG900C FPGA offers a powerful solution with 326080 cells, 25475 CLBs, and a clock speed of 1286MHz

Manufacturer:

XILINX
Mfr.Part #:

XC7K325T-2FBG900C
Datasheet:

XC7K325T-2FBG900C Datasheet (PDF)
Pbfree Code:

Yes
Part Life Cycle Code:

Transferred
Pin Count:

900
Reach Compliance Code:

compliant
EDA/CAD Models:

Request Free CAD Models for XC7K325T-2FBG900C

Email: [email protected]

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XC7K325T-2FBG900C General Description

The XC7K325T-2FBG900C offers unparalleled performance and superior reconfigurability, making it an ideal solution for high-performance computing, wireless communication, industrial automation, and aerospace applications. With its impressive logic cell count, abundant memory resources, and extensive I/O capabilities, this FPGA is well-equipped to handle the demands of data-intensive and computationally complex tasks. The FBGA package with a 0.8mm pitch ensures reliable and secure integration into various systems, while the -2 speed grade enables it to operate at a maximum frequency of 2 GHz. Whether used for signal processing, protocol conversion, or data compression, the XC7K325T-2FBG900C delivers exceptional performance and flexibility for a wide range of applications

Specifications

Pbfree Code	Yes	Part Life Cycle Code	Transferred
Pin Count	900	Reach Compliance Code	compliant
ECCN Code	3A991.D	HTS Code	8542.39.00.01
Clock Frequency-Max	1818 MHz	Combinatorial Delay of a CLB-Max	0.61 ns
JESD-30 Code	S-PBGA-B900	JESD-609 Code	e1
Length	31 mm	Moisture Sensitivity Level	4
Number of CLBs	25475	Number of Inputs	500
Number of Logic Cells	326080	Number of Outputs	500
Number of Terminals	900	Operating Temperature-Max	85 °C
Operating Temperature-Min		Organization	25475 CLBS
Peak Reflow Temperature (Cel)	245	Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Seated Height-Max	2.54 mm
Supply Voltage-Max	1.03 V	Supply Voltage-Min	0.97 V
Supply Voltage-Nom	1 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	OTHER
Terminal Finish	TIN SILVER COPPER	Terminal Form	BALL
Terminal Pitch	1 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	Width	31 mm