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See Technical Specifications

XC7Z035-1FFG676I +BOM

Advanced system on chip with ARM Cortex-A9 processor and Kintex-7 FPGA

Manufacturer:

XILINX
Mfr.Part #:

XC7Z035-1FFG676I
Datasheet:

XC7Z035-1FFG676I Datasheet (PDF)
Part Life Cycle Code:

Transferred
Reach Compliance Code:

compliant
ECCN Code:

3A991.D
HTS Code:

8542.39.00.01
EDA/CAD Models:

Request Free CAD Models for XC7Z035-1FFG676I

Email: [email protected]

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Tel: +852 95804164

XC7Z035-1FFG676I General Description

Featuring a high-performance, dual-core ARM Cortex-A9 processing system integrated with 7 series FPGA fabric, the XC7Z035-1FFG676I from Xilinx delivers impressive capabilities for a variety of applications. The processing system includes two ARM Cortex-A9 cores operating at speeds of up to 667 MHz, complemented by 32KB instruction and data caches per core, as well as a 256KB L2 cache for shared data and instructions. On the programmable logic front, the SoC offers 53,200 logic cells, 63,900 logic slices, 1,265,056 bits of block RAM, and 240 DSP slices, ensuring efficient and versatile processing. Moreover, the 676-pin fine-pitch ball grid array (FFG676) package provides extensive I/O capabilities, supporting standard interfaces such as Gigabit Ethernet, USB, PCIe, and SATA. Whether for industrial automation, aerospace and defense, automotive, or telecommunications applications, the XC7Z035-1FFG676I is a robust and flexible solution that can meet the demands of various embedded systems and beyond

Specifications

Part Life Cycle Code	Transferred	Reach Compliance Code	compliant
ECCN Code	3A991.D	HTS Code	8542.39.00.01
Factory Lead Time	65 Weeks	JESD-30 Code	S-PBGA-B676
Length	27 mm	Number of Terminals	676
Operating Temperature-Max	100 °C	Operating Temperature-Min	-40 °C
Seated Height-Max	3.24 mm	Supply Voltage-Max	1.05 V
Supply Voltage-Min	0.95 V	Supply Voltage-Nom	1 V
Surface Mount	YES	Technology	CMOS
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Width	27 mm
uPs/uCs/Peripheral ICs Type	SYSTEM ON CHIP