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See Technical Specifications

XCKU060-2FFVA1156I +BOM

FPGA Kintex UltraScale 580440 Cells 20nm Technology 0.95V 1156-Pin FC-BGA Tray

Manufacturer:

XILINX
Mfr.Part #:

XCKU060-2FFVA1156I
Datasheet:

XCKU060-2FFVA1156I Datasheet (PDF)
Part Life Cycle Code:

Transferred
Reach Compliance Code:

compliant
ECCN Code:

3A991.D
HTS Code:

8542.39.00.01
EDA/CAD Models:

Request Free CAD Models for XCKU060-2FFVA1156I

XCKU060-2FFVA1156I General Description

Enter the realm of unparalleled computing power with the XCKU060-2FFVA1156I FPGA from Xilinx. Part of the esteemed Kintex UltraScale family, this device houses a formidable arsenal of 60,000 logic cells. Operating at a precise speed grade, it is packaged in a 1156-pin flip-chip ball grid array for optimal connectivity and efficiency. Equipped with advanced features like UltraRAM and high-speed transceivers, this FPGA is a go-to choice for demanding applications across diverse industries

Specifications

Part Life Cycle Code	Transferred	Reach Compliance Code	compliant
ECCN Code	3A991.D	HTS Code	8542.39.00.01
Factory Lead Time	52 Weeks	JESD-30 Code	S-PBGA-B1156
JESD-609 Code	e1	Length	35 mm
Moisture Sensitivity Level	4	Number of CLBs	2760
Number of Inputs	624	Number of Logic Cells	725550
Number of Outputs	624	Number of Terminals	1156
Operating Temperature-Max	100 °C	Operating Temperature-Min	-40 °C
Organization	2760 CLBS	Peak Reflow Temperature (Cel)	245
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	Qualification Status	Not Qualified
Seated Height-Max	3.51 mm	Supply Voltage-Max	0.979 V
Supply Voltage-Min	0.922 V	Supply Voltage-Nom	0.95 V
Surface Mount	YES	Temperature Grade	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER	Terminal Form	BALL
Terminal Pitch	1 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	Width	35 mm