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XCZU15EG-1FFVB1156I +BOM

SoC FPGA XCZU15EG-1FFVB1156I

Manufacturer:

XILINX
Mfr.Part #:

XCZU15EG-1FFVB1156I
Datasheet:

XCZU15EG-1FFVB1156I Datasheet (PDF)
Part Life Cycle Code:

Transferred
Reach Compliance Code:

compliant
ECCN Code:

5A002.A.4
HTS Code:

8542.39.00.01
EDA/CAD Models:

Request Free CAD Models for XCZU15EG-1FFVB1156I

XCZU15EG-1FFVB1156I General Description

Designed for industries such as automotive, industrial automation, aerospace, and telecommunications, the XCZU15EG-1FFVB1156I is tailored to meet the rigorous demands of these sectors with its low latency, high-speed interfaces, and real-time processing features. Its integration with the Vivado Design Suite ensures a smooth development process for engineers looking to incorporate this SoC into their projects

Specifications

Part Life Cycle Code	Transferred	Reach Compliance Code	compliant
ECCN Code	5A002.A.4	HTS Code	8542.39.00.01
Factory Lead Time	52 Weeks	JESD-30 Code	R-PBGA-B1156
JESD-609 Code	e1	Moisture Sensitivity Level	4
Number of Terminals	1156	Operating Temperature-Max	100 °C
Operating Temperature-Min	-40 °C	Peak Reflow Temperature (Cel)	245
Supply Voltage-Max	0.876 V	Supply Voltage-Min	0.825 V
Supply Voltage-Nom	0.85 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Finish	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Terminal Form	BALL
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR CIRCUIT	Series	Zynq® UltraScale+™ MPSoC EG
Architecture	MCU, FPGA	Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size	256KB	Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed	500MHz, 600MHz, 1.2GHz
Primary Attributes	Zynq®UltraScale+™ FPGA, 747K+ Logic Cells	Operating Temperature	-40°C ~ 100°C (TJ)
Number of I/O	328	Base Product Number	XCZU15