This website uses cookies. By using this site, you consent to the use of cookies. For more information, please take a look at our Privacy Policy.

Images are for reference only,

See Technical Specifications

XCZU19EG-2FFVB1517I +BOM

System on Chip FPGA XCZU19EG-2FFVB1517I

Manufacturer:

AMD
Mfr.Part #:

XCZU19EG-2FFVB1517I
Datasheet:

XCZU19EG-2FFVB1517I Datasheet (PDF)
Series:

Zynq® UltraScale+™ MPSoC EG
Architecture:

MCU, FPGA
Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size:

256KB
EDA/CAD Models:

Request Free CAD Models for XCZU19EG-2FFVB1517I

XCZU19EG-2FFVB1517I General Description

The XCZU19EG-2FFVB1517I is a cutting-edge Zynq UltraScale+ MPSoC specifically designed for demanding industrial, automotive, and aerospace applications. With a powerful combination of quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors, along with a 16nm FinFET+ programmable logic fabric, this device offers high levels of processing power and memory capacity. Moreover, its extended temperature range and secure features make it ideal for use in harsh environments where reliability is crucial. The XCZU19EG-2FFVB1517I boasts 32GB of DDR4 memory, integrated high-speed transceivers, multiple Gigabit Ethernet ports, a PCIe Gen3 interface, and support for various communication protocols, ensuring versatility and connectivity

Specifications

Series	Zynq® UltraScale+™ MPSoC EG	Architecture	MCU, FPGA
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	RAM Size	256KB
Peripherals	DMA, WDT	Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed	533MHz, 600MHz, 1.3GHz	Primary Attributes	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature	-40°C ~ 100°C (TJ)	Number of I/O	644
Base Product Number	XCZU19