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XCZU3CG-1SFVA625E +BOM

XCZU3CG-1SFVA625E Integrated FPGA"

Manufacturer:

XILINX INC
Mfr.Part #:

XCZU3CG-1SFVA625E
Datasheet:

XCZU3CG-1SFVA625E Datasheet (PDF)
Part Life Cycle Code:

Active
Reach Compliance Code:

compliant
ECCN Code:

5A002.A.4
HTS Code:

8542.39.00.01
EDA/CAD Models:

Request Free CAD Models for XCZU3CG-1SFVA625E

XCZU3CG-1SFVA625E General Description

In addition to its formidable processing system, the XCZU3CG-1SFVA625E offers a generous 53,200 logic cells, 33.3Mb of block RAM, and 2660 DSP slices, making it an ideal choice for applications that demand efficient handling of signal and data-intensive tasks. Its array of I/O options, including 32.5Gb/s transceivers, PCIe Gen3 interfaces, DDR4 memory interfaces, and Gigabit Ethernet ports, further enhance its connectivity and versatility

Key Features

Zynq® UltraScale+™ multiprocessor system-on-chips are available in -3, -2, -1 speed grades
Innovative ARM® + FPGA architecture for differentiation, analytics & control
Extensive OS, middleware, stacks, accelerators and IP ecosystem
Multiple levels of hardware and software security, architected to deliver low system power
Integration delivering the de facto All Programmable platform
Up to 5X system level performance per watt over Zynq®-7000 SoCs
DDR4, LPDDR4, DDR3, DDR3L, LPDDR3 dynamic memory interfaces
Most flexible and scalable platform for maximum reuse and best TTM
Industry leading design tools, C/C++, open CL design abstractions
PCIe® Gen2, USB3.0, SATA 3.1, DisplayPort, gigabit Ethernet high speed peripherals

Specifications

Part Life Cycle Code	Active	Reach Compliance Code	compliant
ECCN Code	5A002.A.4	HTS Code	8542.39.00.01
Factory Lead Time	52 Weeks	JESD-30 Code	R-PBGA-B625
JESD-609 Code	e1	Moisture Sensitivity Level	4
Number of Terminals	625	Operating Temperature-Max	100 °C
Operating Temperature-Min		Peak Reflow Temperature (Cel)	250
Supply Voltage-Max	0.876 V	Supply Voltage-Min	0.825 V
Supply Voltage-Nom	0.85 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	OTHER
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)	Terminal Form	BALL
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR CIRCUIT