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XCZU9CG-1FFVC900I +BOM

Cutting-edge FLIPCHIP-900 technology for improved reliability

Manufacturer:

AMD
Mfr.Part #:

XCZU9CG-1FFVC900I
Datasheet:

XCZU9CG-1FFVC900I Datasheet (PDF)
Series:

Zynq® UltraScale+™ MPSoC CG
Architecture:

MCU, FPGA
Core Processor:

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size:

256KB
EDA/CAD Models:

Request Free CAD Models for XCZU9CG-1FFVC900I

XCZU9CG-1FFVC900I General Description

Featuring 600K logic cells, 732 DSP slices, and 1836 KB of block RAM, the XCZU9CG-1FFVC900I provides ample resources for complex designs. Its array of high-speed interfaces, including 16.3 Gb/s transceivers, PCIe Gen3 x16, and DDR4 memory interfaces, further bolster its connectivity options

Specifications

Series	Zynq® UltraScale+™ MPSoC CG	Architecture	MCU, FPGA
Core Processor	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	RAM Size	256KB
Peripherals	DMA, WDT	Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed	500MHz, 1.2GHz	Primary Attributes	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature	-40°C ~ 100°C (TJ)	Number of I/O	204
Base Product Number	XCZU9