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AS4C256M16D3B-12BIN +BOM

Low voltage DRAM module

AS4C256M16D3B-12BIN General Description

In addition to its impressive technical specifications, the AS4C256M16D3B-12BIN also meets the JEDEC standard for DDR3 SDRAM modules, ensuring compatibility and interoperability with a wide range of systems. Its industrial temperature range of -40°C to 95°C and compact FBGA package make it suitable for deployment in harsh environmental conditions. Furthermore, its RoHS compliance and lead-free composition underscore its commitment to environmental sustainability

Key Features

AUTO/SELF REFRESH

Specifications

Part Life Cycle Code End Of Life Reach Compliance Code compliant
ECCN Code EAR99 HTS Code 8542.32.00.36
Access Mode MULTI BANK PAGE BURST Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B96 JESD-609 Code e1
Length 13.5 mm Memory Density 4294967296 bit
Memory IC Type DDR3 DRAM Memory Width 16
Moisture Sensitivity Level 3 Number of Functions 1
Number of Ports 1 Number of Terminals 96
Number of Words 268435456 words Number of Words Code 256000000
Operating Mode SYNCHRONOUS Operating Temperature-Max 85 °C
Operating Temperature-Min Organization 256MX16
Peak Reflow Temperature (Cel) 260 Seated Height-Max 1.2 mm
Self Refresh YES Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES Technology CMOS
Temperature Grade OTHER Terminal Finish TIN SILVER COPPER
Terminal Form BALL Terminal Pitch 0.8 mm
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) 30
Width 9 mm

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