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AS4C256M16D3B-12BIN +BOM
Low voltage DRAM module
FBGA-96-
Manufacturer:
ALLIANCE MEMORY INC
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Mfr.Part #:
AS4C256M16D3B-12BIN
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Datasheet:
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Part Life Cycle Code:
End Of Life
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Reach Compliance Code:
compliant
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ECCN Code:
EAR99
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HTS Code:
8542.32.00.36
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EDA/CAD Models:
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Availability: 7072 PCS
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AS4C256M16D3B-12BIN General Description
In addition to its impressive technical specifications, the AS4C256M16D3B-12BIN also meets the JEDEC standard for DDR3 SDRAM modules, ensuring compatibility and interoperability with a wide range of systems. Its industrial temperature range of -40°C to 95°C and compact FBGA package make it suitable for deployment in harsh environmental conditions. Furthermore, its RoHS compliance and lead-free composition underscore its commitment to environmental sustainability
Key Features
AUTO/SELF REFRESHSpecifications
Part Life Cycle Code | End Of Life | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code | 8542.32.00.36 |
Access Mode | MULTI BANK PAGE BURST | Additional Feature | AUTO/SELF REFRESH |
JESD-30 Code | R-PBGA-B96 | JESD-609 Code | e1 |
Length | 13.5 mm | Memory Density | 4294967296 bit |
Memory IC Type | DDR3 DRAM | Memory Width | 16 |
Moisture Sensitivity Level | 3 | Number of Functions | 1 |
Number of Ports | 1 | Number of Terminals | 96 |
Number of Words | 268435456 words | Number of Words Code | 256000000 |
Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | Organization | 256MX16 | |
Peak Reflow Temperature (Cel) | 260 | Seated Height-Max | 1.2 mm |
Self Refresh | YES | Supply Voltage-Max (Vsup) | 1.575 V |
Supply Voltage-Min (Vsup) | 1.425 V | Supply Voltage-Nom (Vsup) | 1.5 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | OTHER | Terminal Finish | TIN SILVER COPPER |
Terminal Form | BALL | Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 9 mm |
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[email protected]Shipping Method
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In Stock: 7,072
Minimum Order: 1
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