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See Technical Specifications

BR25G320FVT-3GE2 +BOM

EEPROM SPI BUS 32K 1.6-5.5 Std TSSOP-B8

Manufacturer:

ROHM Semiconductor
Mfr.Part #:

BR25G320FVT-3GE2
Datasheet:

BR25G320FVT-3GE2 Datasheet (PDF)
Mounting Style:

SMD/SMT
Interface Type:

SPI
Memory Size:

32 kbit
Organization:

4 k x 8
EDA/CAD Models:

Request Free CAD Models for BR25G320FVT-3GE2

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BR25G320FVT-3GE2 General Description

In terms of power consumption, the BR25G320FVT-3GE2 has a power dissipation of 330mW, ensuring efficient energy usage. Its surface mount design and 8-pin TSSOP package make it easy to integrate into circuit boards, while the emboss T/R - Tape and Reel packaging provides convenience for bulk ordering and assembly

Key Features

Multiplexed Address Bus Access
Single-Ended Data Input/Output
Programmable Read Only Memory Area
Data Lockout Functionality

Specifications

Product Category:	EEPROM	Mounting Style:	SMD/SMT
Interface Type:	SPI	Memory Size:	32 kbit
Organization:	4 k x 8	Supply Voltage - Min:	1.6 V
Supply Voltage - Max:	5.5 V	Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C	Maximum Clock Frequency:	20 MHz
Access Time:	-	Data Retention:	100 Year
Supply Current - Max:	8 mA	Packaging:	MouseReel
Active Read Current - Max:	8 mA	Operating Supply Current:	100 nA
Operating Supply Voltage:	1.6 V to 5.5 V	Product Type:	EEPROM
Factory Pack Quantity:	3000	Subcategory:	Memory & Data Storage
Part # Aliases:	BR25G320FVT-3