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FBGA
Manufacturer:
Samsung Electronics
Mfr.Part #:
K4B4G0846E-BYK0
Datasheet:
ECCN (US):
EAR99
HTS:
8542.32.00.36
Automotive:
No
PPAP:
No
EDA/CAD Models:
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The K4B4G0846E-BYK0 is a specific model of electronic component known as a synchronous dynamic random-access memorymodule.
ECCN (US) | EAR99 | Part Status | LTB |
HTS | 8542.32.00.36 | Automotive | No |
PPAP | No | DRAM Type | DDR3L SDRAM |
Chip Density (bit) | 4G | Organization | 512Mx8 |
Number of Internal Banks | 8 | Number of Words per Bank | 64M |
Number of Bits/Word (bit) | 8 | Data Bus Width (bit) | 8 |
Maximum Clock Rate (MHz) | 1600 | Maximum Access Time (ns) | 0.225 |
Address Bus Width (bit) | 19 | Minimum Operating Supply Voltage (V) | 1.283|1.425 |
Typical Operating Supply Voltage (V) | 1.35|1.5 | Maximum Operating Supply Voltage (V) | 1.45|1.575 |
Operating Current (mA) | 71 | Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 95 | Supplier Temperature Grade | Commercial |
Number of I/O Lines (bit) | 8 | Mounting | Surface Mount |
PCB changed | 78 | Pin Count | 78 |
Lead Shape | Ball |
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