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MT29F2G08ABBEAHC-IT:E +BOM

Flash memory with a capacity of 256 megabits organized in an 8-bit configuration with a fast access time of 25 nanoseconds

MT29F2G08ABBEAHC-IT:E General Description

In terms of reliability, the MT29F2G08ABBEAHC-IT:E is equipped with built-in error correction and wear-leveling algorithms, ensuring data integrity and longevity. It also offers support for features like bad block management, data protection, and secure erase functions, providing enhanced security and peace of mind for users who prioritize the safety of their data

Key Features

  • Open NAND Flash Interface (ONFI) 2.2-compliant1
  • Multiple-level cell (MLC) technology
  • Organization
  • – Page size x8: 8640 bytes (8192 + 448 bytes)
  • – Block size: 256 pages (2048K + 112K bytes)
  • – Plane size: 2 planes x 2048 blocks per plane
  • – Device size: 64Gb: 4096 blocks;
  • 128Gb: 8192 blocks;
  • 256Gb: 16,384 blocks;
  • 512Gb: 32,786 blocks
  • Synchronous I/O performance
  • – Up to synchronous timing mode 5
  • – Clock rate: 10ns (DDR)
  • – Read/write throughput per pin: 200 MT/s
  • Asynchronous I/O performance
  • – Up to asynchronous timing mode 5
  • tRC/tWC: 20ns (MIN)
  • Array performance
  • – Read page: 50µs (MAX)
  • – Program page: 1300µs (TYP)
  • – Erase block: 3ms (TYP)
  • Operating Voltage Range
  • – VCC: 2.7–3.6V
  • – VCCQ: 1.7–1.95V, 2.7–3.6V
  • Command set: ONFI NAND Flash Protocol
  • Advanced Command Set
  • – Program cache
  • – Read cache sequential
  • – Read cache random
  • – One-time programmable (OTP) mode
  • – Multi-plane commands
  • – Multi-LUN operations
  • – Read unique ID
  • – Copyback
  • First block (block address 00h) is valid when shipped
  • from factory. For minimum required ECC, see
  • Error Management (page 109).
  • RESET (FFh) required as first command after power
  • Operation status byte provides software method for
  • detecting
  • – Operation completion
  • – Pass/fail condition
  • – Write-protect status
  • Data strobe (DQS) signals provide a hardware method
  • for synchronizing data DQ in the synchronous
  • interface
  • Copyback operations supported within the plane
  • from which data is read
  • Quality and reliability
  • – Data retention: 10 years
  • – Endurance: 5000 PROGRAM/ERASE cycles
  • Operating temperature:
  • – Commercial: 0°C to +70°C
  • – Industrial (IT): –40ºC to +85ºC
  • Package
  • – 52-pad LGA
  • – 48-pin TSOP
  • – 100-ball BGA

Specifications

Programmabe Verified Memory Type Non-Volatile
Memory Format FLASH Technology FLASH - NAND
Memory Size 2Gbit Memory Organization 256M x 8
Memory Interface Parallel Clock Frequency -
Write Cycle Time - Word, Page - Access Time -
Voltage - Supply 1.7V ~ 1.95V Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount

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