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NT5DS32M16DS-5T +BOM

DDR SDRAM DRAM Chip

Key Features

Double data rate architecture: two data transfers per clock cycle

Bidirectional data strobe (DQS) is transmitted and received with data, to be used in capturing data at the receiver

DQS is edge-aligned with data for reads and is center aligned with data for writes

Differential clock inputs (CK and CK)

Four internal banks for concurrent operation

Data mask (DM) for write data

DLL aligns DQ and DQS transitions with CK transitions, also aligns QFC transitions with CK during Read cyclesCommands entered on each positive CK edge; data and data mask referenced to both edges of DQS

Burst lengths: 2, 4, or 8

CAS Latency: 2, 2.5

Auto Precharge option for each burst access

Auto Refresh and Self Refresh Modes

15.6ms Maximum Average Periodic Refresh Interval

Supports tRAS lockout feature

2.5V (SSTL_2 compatible) I/O

VDDQ = 2.5V0.2V

VDD = 2.5V0.2V

-7K parts support PC2100 modules.

-75B parts support PC2100 modules

-8B parts support PC1600 modules

Specifications

Product Category Memory ICs

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