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See Technical Specifications

W25M02GWZEIG +BOM

2G-bit Serial NAND flash Multichip Packages, 1.8V

Manufacturer:

Winbond Electronics
Mfr.Part #:

W25M02GWZEIG
Datasheet:

W25M02GWZEIG Datasheet (PDF)
Series:

SpiFlash®
Programmabe:

Not Verified
Memory Type:

Non-Volatile
Memory Format:

FLASH
EDA/CAD Models:

Request Free CAD Models for W25M02GWZEIG

W25M02GWZEIG General Description

The W25M02GWZEIG is a top-of-the-line 2Gbit flash memory chip from Winbond Electronics Corporation. Engineered for automotive and industrial applications, this SpiFlash family member offers high-speed data transfer, low-voltage operation, and extreme temperature resilience. Its impressive read throughput of 83MB/s and program throughput of 80MB/s make it a standout choice for demanding industrial and automotive environments. With a voltage supply range of 2.7V to 3.6V and an operating temperature range of -40°C to 105°C, the W25M02GWZEIG is built to withstand harsh conditions while maintaining peak performance. Its high endurance, with up to 100,000 program/erase cycles, ensures long-term reliability and durability, making it a solid investment for demanding applications. Additionally, the chip comes equipped with advanced security features, including hardware-based AES encryption and Secure Unique ID, providing robust data protection and peace of mind

Key Features

New Family of SpiFlash Memories
– W25M02GW: 2x1G-bit / 2x128M-Byte
– Standard SPI: CLK, /CS, DI, DO, /WP, /HOLD
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /HOLD
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– Compatible SPI serial flash commands
Highest Performance Serial NAND Flash
– 104MHz Standard/Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 40MB/S continuous data transfer rate
– Fast Program/Erase performance
– More than 100,000 erase/program cycles
– More than 10-year data retention
Efficient “Continuous Read Mode”(1)
– Alternative method to the Buffer Read Mode
– No need to issue “Page Data Read” between
Read commands
– Allows direct read access to the entire array
Flexible “Concurrent Operations”
– Independent single die access
– Allows “Read while Program/Erase”
– Allows “Multi Die Program/Erase”
– Improves Program/Erase throughput
Low Power, Wide Temperature Range
– Single 1.70 to 1.95V supply
– 25mA active, 20µA standby current
– -40°C to +85°C operating range
Flexible Architecture with 128KB blocks
– Uniform 128K-Byte Block Erase
– Flexible page data load methods
Advanced Features
– On chip 1-Bit ECC for memory array
– ECC status bits indicate ECC results
– bad block management and LUT(2) access
– Software and Hardware Write-Protect
– Power Supply Lock-Down and OTP protection
– 2KB Unique ID and 2KB parameter pages
– Ten 2KB OTP pages(3)
Space Efficient Packaging
– 8-pad WSON 8x6-mm
– 24-ball TFBGA 8x6-mm
– Contact Winbond for other package options

Specifications

Series	SpiFlash®	Programmabe	Not Verified
Memory Type	Non-Volatile	Memory Format	FLASH
Technology	FLASH - NAND (SLC)	Memory Size	2Gbit
Memory Organization	256M x 8	Memory Interface	SPI - Quad I/O
Clock Frequency	104 MHz	Write Cycle Time - Word, Page	700µs
Voltage - Supply	1.7V ~ 1.95V	Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount	Base Product Number	W25M02