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See Technical Specifications

W25Q128FWEIG +BOM

Compact WSON-package with low power consumpti

Manufacturer:

WINBOND ELECTRONICS CORP
Mfr.Part #:

W25Q128FWEIG
Datasheet:

W25Q128FWEIG Datasheet (PDF)
Part Life Cycle Code:

Obsolete
Pin Count:

8
Reach Compliance Code:

compliant
ECCN Code:

EAR99
EDA/CAD Models:

Request Free CAD Models for W25Q128FWEIG

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

W25Q128FWEIG General Description

In addition to its impressive technical specifications, the W25Q128FWEIG also offers robust security features to protect your valuable data. Equipped with block lock and security registers, this chip ensures that your information remains safe from unauthorized access. Furthermore, its low power consumption makes it an ideal choice for devices that rely on battery power, extending the lifespan of your electronics

Key Features

New Family of SpiFlash Memories
– W25Q128FW: 128M-bit / 16M-byte
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– QPI: CLK, /CS, IO0, IO1, IO2, IO3
– Software & Hardware Reset
Highest Performance Serial Flash
– 104MHz Single, Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 50MB/S continuous data transfer rate
– More than 100,000 erase/program cycles
– More than 20-year data retention
Efficient “Continuous Read” and QPI Mode
– Continuous Read with 8/16/32/64-Byte
Wrap
– As few as 8 clocks to address memory
– Quad Peripheral Interface (QPI) reduces
instruction overhead
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
Low Power, Wide Temperature Range
– Single 1.65 to 1.95V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range
Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
Advanced Security Features
– Software and Hardware Write-Protect
– Power Supply Lock-Down and OTP protection
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
Space Efficient Packaging
– 8-pin SOIC 208-mil
– 8-pad WSON 6x5-mm / 8x6-mm
– 16-pin SOIC 300-mil (additional /RESET pin)
– 24-ball TFBGA 8x6-mm
– Contact Winbond for KGD and other options

Specifications

Part Life Cycle Code	Obsolete	Pin Count	8
Reach Compliance Code	compliant	ECCN Code	EAR99
HTS Code	8542.32.00.51	Clock Frequency-Max (fCLK)	104 MHz
Data Retention Time-Min	20	Endurance	100000 Write/Erase Cycles
JESD-30 Code	R-PDSO-N8	Length	8 mm
Memory Density	134217728 bit	Memory IC Type	FLASH
Memory Width	1	Number of Functions	1
Number of Terminals	8	Number of Words	134217728 words
Number of Words Code	128000000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	128MX1	Parallel/Serial	SERIAL
Power Supplies	1.8 V	Programming Voltage	1.8 V
Qualification Status	Not Qualified	Seated Height-Max	0.8 mm
Serial Bus Type	SPI	Standby Current-Max	0.00002 A
Supply Current-Max	0.025 mA	Supply Voltage-Max (Vsup)	1.95 V
Supply Voltage-Min (Vsup)	1.7 V	Supply Voltage-Nom (Vsup)	1.8 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	INDUSTRIAL	Terminal Form	NO LEAD
Terminal Pitch	1.27 mm	Terminal Position	DUAL
Type	NOR TYPE	Width	6 mm
Write Protection	HARDWARE/SOFTWARE