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See Technical Specifications

W25Q32BVZPIG +BOM

RoHS Compliant W25Q32BVZPIG Flash Memory

Manufacturer:

WINBOND ELECTRONICS CORP
Mfr.Part #:

W25Q32BVZPIG
Datasheet:

W25Q32BVZPIG Datasheet (PDF)
Part Life Cycle Code:

Obsolete
Pin Count:

8
Reach Compliance Code:

compliant
ECCN Code:

EAR99
EDA/CAD Models:

Request Free CAD Models for W25Q32BVZPIG

Email: [email protected]

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Tel: +852 95804164

W25Q32BVZPIG General Description

The W25Q32BVZPIG is a reliable and versatile serial flash memory chip crafted by the reputable Winbond Electronics. With a generous storage capacity of 32 megabits, equivalent to 4 megabytes, this chip operates seamlessly on a serial peripheral interface (SPI) bus. Harnessing a remarkable clock rate of up to 104 MHz, this chip ensures swift read and write operations that cater to the demands of various applications

Key Features

Family of SpiFlash Memories
– W25Q32BV: 32M-bit / 4M-byte (4,194,304)
– 256-byte per programmable page
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
Highest Performance Serial Flash
– 104MHz Dual SPI / 80MHz Quad SPI clocks
– 208/320MHz equivalent Dual/Quad SPI
– 40MB/S continuous data transfer rate
– Up to 8X that of ordinary Serial Flash
– More than 100,000 erase/program cycles(1)
– More than 20-year data retention
Efficient “Continuous Read Mode”
– Low Instruction overhead
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
Low Power, Wide Temperature Range
– Single 2.7 to 3.6V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range
Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4/32/64K-bytes)
– Program one to 256 bytes
– Erase/Program Suspend & Resume
Advanced Security Features
– Software and Hardware Write-Protect
– Top/Bottom, 4KB complement array protection
– Power Supply Lock-Down and OTP protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Byte Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
Space Efficient Packaging(1)
– 8-pin SOIC/VSOP 208-mil
– 8-pad WSON 6x5-mm/8x6-mm
– 16-pin SOIC 300-mil
– 8-pin PDIP 300-mil
– 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
– Contact Winbond for KGD and other options

Specifications

Part Life Cycle Code	Obsolete	Pin Count	8
Reach Compliance Code	compliant	ECCN Code	EAR99
HTS Code	8542.32.00.51	Clock Frequency-Max (fCLK)	80 MHz
Data Retention Time-Min	20	Endurance	100000 Write/Erase Cycles
JESD-30 Code	R-PDSO-N8	Length	6 mm
Memory Density	33554432 bit	Memory IC Type	FLASH
Memory Width	1	Number of Functions	1
Number of Terminals	8	Number of Words	33554432 words
Number of Words Code	32000000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	32MX1	Parallel/Serial	SERIAL
Power Supplies	3/3.3 V	Programming Voltage	2.7 V
Qualification Status	Not Qualified	Seated Height-Max	0.8 mm
Serial Bus Type	SPI	Standby Current-Max	0.000005 A
Supply Current-Max	0.025 mA	Supply Voltage-Max (Vsup)	3.6 V
Supply Voltage-Min (Vsup)	2.7 V	Supply Voltage-Nom (Vsup)	3 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	INDUSTRIAL	Terminal Form	NO LEAD
Terminal Pitch	1.27 mm	Terminal Position	DUAL
Type	NOR TYPE	Width	5 mm
Write Protection	HARDWARE/SOFTWARE