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See Technical Specifications

W25Q32FWZPIG +BOM

The W25Q32FWZPIG

Manufacturer:

WINBOND ELECTRONICS CORP
Mfr.Part #:

W25Q32FWZPIG
Datasheet:

W25Q32FWZPIG Datasheet (PDF)
Part Life Cycle Code:

Obsolete
Reach Compliance Code:

compliant
ECCN Code:

EAR99
HTS Code:

8542.32.00.51
EDA/CAD Models:

Request Free CAD Models for W25Q32FWZPIG

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

W25Q32FWZPIG General Description

Winbond's W25Q32FWZPIG is a cutting-edge serial NOR flash memory chip that sets a new benchmark for non-volatile storage solutions. With a generous capacity of 32 Megabits (4 Megabytes), this chip is poised to revolutionize data storage in consumer electronics, industrial control systems, and automotive applications. Its standard SPI interface, boasting clock frequencies of up to 104 MHz, ensures lightning-fast read and write operations, catapulting it to the forefront of high-performance memory solutions

Key Features

New Family of SpiFlash Memories
– W25Q32FW: 32M-bit / 4M-byte
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– QPI: CLK, /CS, IO0, IO1, IO2, IO3
– Software & Hardware Reset
Highest Performance Serial Flash
– 104MHz Single, Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 50MB/S continuous data transfer rate
– Min 100K Program-Erase cycles per secto
– More than 20-year data retention
Efficient “Continuous Read” and QPI Mode
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Quad Peripheral Interface (QPI) reduces instruction overhead
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
Advanced Security Features
– Software and Hardware Write-Protect
– Power Supply Lock-Down and OTP protection
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
Space Efficient Packaging
– 8-pin SOIC/VSOP 208-mil, XSON 4x4-mm
– 8-pad WSON 6x5-mm / 8x6-mm
– 16-pin SOIC 300-mil (additional /RESET)
– 24-ball TFBGA 8x6-mm(additional /RESET)
– 12-ball WLCSP
– Contact Winbond for KGD and other options

Specifications

Part Life Cycle Code	Obsolete	Reach Compliance Code	compliant
ECCN Code	EAR99	HTS Code	8542.32.00.51
Alternate Memory Width	1	Clock Frequency-Max (fCLK)	104 MHz
Data Retention Time-Min	20	Endurance	100000 Write/Erase Cycles
JESD-30 Code	R-PDSO-N8	Length	6 mm
Memory Density	33554432 bit	Memory IC Type	FLASH
Memory Width	8	Number of Functions	1
Number of Terminals	8	Number of Words	4194304 words
Number of Words Code	4000000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	4MX8	Parallel/Serial	SERIAL
Peak Reflow Temperature (Cel)	NOT SPECIFIED	Power Supplies	1.8 V
Programming Voltage	1.8 V	Qualification Status	Not Qualified
Seated Height-Max	0.8 mm	Serial Bus Type	SPI
Standby Current-Max	0.00002 A	Supply Current-Max	0.02 mA
Supply Voltage-Max (Vsup)	1.95 V	Supply Voltage-Min (Vsup)	1.65 V
Supply Voltage-Nom (Vsup)	1.8 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Form	NO LEAD	Terminal Pitch	1.27 mm
Terminal Position	DUAL	Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Type	NOR TYPE	Width	5 mm
Write Protection	HARDWARE/SOFTWARE