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High Density DRAM Chip
TFBGA-24Manufacturer:
WINBOND ELECTRONICS CORP
Mfr.Part #:
W956A8MBYA5I
Datasheet:
Part Life Cycle Code:
Not Recommended
Reach Compliance Code:
compliant
ECCN Code:
EAR99
HTS Code:
8542.32.00.02
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HyperRAM Memory IC 64Mbit HyperBus 200 MHz 35 ns 24-TFBGA (6x8)
Part Life Cycle Code | Not Recommended | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code | 8542.32.00.02 |
Date Of Intro | 2019-09-25 | Additional Feature | AUTO/SELF REFRESH |
Clock Frequency-Max (fCLK) | 200 MHz | I/O Type | COMMON |
JESD-30 Code | R-PBGA-B24 | Length | 8 mm |
Memory Density | 67108864 bit | Memory IC Type | HYPERRAM |
Memory Width | 8 | Number of Functions | 1 |
Number of Ports | 1 | Number of Terminals | 24 |
Number of Words | 8388608 words | Number of Words Code | 8000000 |
Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 8MX8 |
Seated Height-Max | 1.2 mm | Self Refresh | YES |
Standby Current-Max | 0.00025 A | Supply Current-Max | 0.03 mA |
Supply Voltage-Max (Vsup) | 3.6 V | Supply Voltage-Min (Vsup) | 2.7 V |
Supply Voltage-Nom (Vsup) | 3 V | Surface Mount | YES |
Technology | CMOS | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Width | 6 mm |
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