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56MX8 0.4ns CMOS PBGA60
WBGA-60Manufacturer:
WINBOND ELECTRONICS CORP
Mfr.Part #:
W972GG8KB25I
Datasheet:
Part Life Cycle Code:
Active
Reach Compliance Code:
compliant
ECCN Code:
EAR99
HTS Code:
8542.32.00.36
EDA/CAD Models:
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What sets the W972GG8KB25I apart from other NAND flash memory chips is its exceptional speed capabilities. Operating at a maximum clock frequency of 50MHz, this chip enables rapid read and write operations, ideal for scenarios where quick data transfer is crucial. Its x8 I/O interface and 2KB page size further enhance its efficiency, while the organization of 64 blocks, each containing 64 pages, ensures optimal data management
Part Life Cycle Code | Active | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code | 8542.32.00.36 |
Access Mode | MULTI BANK PAGE BURST | Access Time-Max | 0.4 ns |
Additional Feature | AUTO/SELF REFRESH | JESD-30 Code | R-PBGA-B60 |
Length | 12.5 mm | Memory Density | 2147483648 bit |
Memory IC Type | DDR2 DRAM | Memory Width | 8 |
Number of Functions | 1 | Number of Ports | 1 |
Number of Terminals | 60 | Number of Words | 268435456 words |
Number of Words Code | 256000000 | Operating Mode | SYNCHRONOUS |
Organization | 256MX8 | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Seated Height-Max | 1.2 mm | Self Refresh | YES |
Supply Voltage-Max (Vsup) | 1.9 V | Supply Voltage-Min (Vsup) | 1.7 V |
Supply Voltage-Nom (Vsup) | 1.8 V | Surface Mount | YES |
Technology | CMOS | Terminal Form | BALL |
Terminal Pitch | 0.8 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | Width | 8 mm |
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