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XC17S200APD8C +BOM
FPGA Configuration PROM Memories product XC17S200APD8C
DIP8-
Manufacturer:
-
Mfr.Part #:
XC17S200APD8C
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Datasheet:
-
Programmable:
Not Verified
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Programmable Type:
OTP
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Memory Size:
2Mb
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Voltage - Supply:
3V ~ 3.6V
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EDA/CAD Models:
Availability: 5516 PCS
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XC17S200APD8C General Description
The XC17S200APD8C is a 3.3V in-system programmable PROM device that provides non-volatile storage of binary data. PROMs are electronic components that store data permanently and can be programmed only once, typically during the manufacturing process. The XC17S200APD8C is designed to be programmed in the system itself, allowing for easy updates and changes without the need for removing the device from the circuit board.
Key Features
- PROM Capacity: The "200" in the part number indicates that the XC17S200APD8C has a capacity of 200 kilobits (Kb) or 25 kilobytes (KB) of storage. This capacity defines the amount of data that the PROM can hold.
- In-System Programmable: The PROM can be programmed in the system using an external programmer or a specific configuration tool provided by Xilinx.
- High-Speed Performance: It offers high-speed operation, making it suitable for applications that require fast access to stored data.
- 3.3V Operation: The PROM operates at a supply voltage of 3.3V, making it compatible with standard 3.3V digital systems.
- PDIP Package: The "PD8C" in the part number indicates that the PROM is packaged in a Plastic Dual In-line Package (PDIP) with 8 leads.
Application
- Configuration Memory
- Microcontroller Boot Memory
- Data Storage
- Embedded Systems
Specifications
Category | Integrated Circuits (ICs)MemoryConfiguration Proms for FPGAs | Series | - |
Programmable | Not Verified | Programmable Type | OTP |
Memory Size | 2Mb | Voltage - Supply | 3V ~ 3.6V |
Operating Temperature | 0°C ~ 70°C | Mounting Type | Through Hole |
Base Product Number | XC17S200A |
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In Stock: 5,516
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