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2304NZLPGGI +BOM

Device for spreading frequency modulation

  • Manufacturer:

    Renesas Electronics Corporation

  • Mfr.Part #:

    2304NZLPGGI

  • Datasheet:

    2304NZLPGGI Datasheet (PDF) pdf-icon

  • Type:

    Fanout Buffer (Distribution)

  • Number Of Circuits:

    1

  • Ratio - InputOutput:

    1:4

  • Differential - InputOutput:

    No/No

2304NZLPGGI General Description

With its advanced 802.11ac Wave2 technology, the 2304NZLPGGI chip sets a new standard for wireless connectivity. The dual-band 2x2 MIMO design enables it to handle high data throughput while maintaining reliable connections, making it suitable for a wide range of applications. From IoT devices to industrial control systems, this high-performance module ensures that your devices can communicate effectively and efficiently

Key Features

  • Dual output
  • Wide common-mode range
  • High accuracy

Specifications

Type Fanout Buffer (Distribution) Number of Circuits 1
Ratio - Input:Output 1:4 Differential - Input:Output No/No
Input LVCMOS Output LVCMOS
Frequency - Max 140 MHz Voltage - Supply 3V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount
Base Product Number 2304

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In Stock: 6,592

Minimum Order: 1

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