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K4T1G164QE-HCE6 +BOM

High-speed memory chip with 64MX16 capacity

email Email: [email protected]
skype Skype: live:.cid.ab6b29428937b76
tel Tel: +852 95804164

Key Features

  • JEDEC standard VDD= 1.8V ± 0.1V Power Supply
  • VDDQ= 1.8V ± 0.1V
  • 333MHz fCKfor 667Mb/sec/pin, 400MHz fCKfor 800Mb/sec/pin
  • 8 Banks
  • Posted CAS
  • Programmable CASLatency: 3, 4, 5, 6
  • Programmable Additive Latenc y: 0, 1, 2, 3, 4, 5
  • Write Latency(WL) = Read Latency(RL) -1
  • Burst Length: 4 , 8(Interleave/nibble sequential)
  • Programmable Sequential / Interleave Burst Mode
  • Bi-directional Differential Data-Strobe (Single-ended data-strobe is an optional feature)
  • Off-Chip Driver(OCD) Impedance Adjustment
  • On Die Termination
  • Special Function Support
  • - 50ohm ODT
  • - High Temperature Self-Refresh rate enable
  • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C
  • All of products are Lead-Free, Halogen-Free, and RoHS compliant

Specifications

Pbfree Code Yes Part Life Cycle Code Obsolete
Reach Compliance Code ECCN Code EAR99
HTS Code 8542.32.00.32 Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.45 ns Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 333 MHz I/O Type COMMON
Interleaved Burst Length 4,8 JESD-30 Code R-PBGA-B84
JESD-609 Code e1 Length 12.5 mm
Memory Density 1073741824 bit Memory IC Type DDR2 DRAM
Memory Width 16 Moisture Sensitivity Level 3
Number of Functions 1 Number of Ports 1
Number of Terminals 84 Number of Words 67108864 words
Number of Words Code 64000000 Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C Operating Temperature-Min
Organization 64MX16 Output Characteristics 3-STATE
Peak Reflow Temperature (Cel) 260 Qualification Status Not Qualified
Refresh Cycles 8192 Seated Height-Max 1.2 mm
Self Refresh YES Sequential Burst Length 4,8
Standby Current-Max 0.01 A Supply Current-Max 0.185 mA
Supply Voltage-Max (Vsup) 1.9 V Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V Surface Mount YES
Technology CMOS Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER Terminal Form BALL
Terminal Pitch 0.8 mm Terminal Position BOTTOM
Width 7.5 mm

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AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.

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