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K4T1G164QF-BCF7 +BOM

Advanced PBGA packaging for compact design and reliability

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K4T1G164QF-BCF7

Key Features

  • JEDEC standard VDD = 1.8V ± 0.1V Power Supply
  • VDDQ = 1.8V ± 0.1V
  • 333MHz fCK for 667Mb/sec/pin, 400MHz fCK for 800Mb/sec/pin
  • 8 Banks
  • Posted CAS
  • Programmable CAS Latency: 3, 4, 5, 6
  • Programmable Additive Latenc y: 0, 1, 2, 3, 4, 5
  • Write Latency(WL) = Read Latency(RL) -1
  • Burst Length: 4 , 8(Interleave/nibble sequential)
  • Programmable Sequential / Interleave Burst Mode
  • Bi-directional Differential Data-Strobe (Single-ended data-strobe is an optional feature)
  • Off-Chip Driver(OCD) Impedance Adjustment
  • On Die Termination
  • Special Function Support
  • - 50ohm ODT
  • - High Temperature Self-Refresh rate enable
  • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C
  • All of products are Lead-Free, Halogen-Free, and RoHS compliant

Specifications

Part Life Cycle Code Obsolete Reach Compliance Code compliant
ECCN Code EAR99 HTS Code 8542.32.00.32
Access Time-Max 0.4 ns Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B84 JESD-609 Code e1
Memory Density 1073741824 bit Memory IC Type DDR2 DRAM
Memory Width 16 Moisture Sensitivity Level 3
Number of Terminals 84 Number of Words 67108864 words
Number of Words Code 64000000 Organization 64MX16
Output Characteristics 3-STATE Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Refresh Cycles 8192
Sequential Burst Length 4,8 Standby Current-Max 0.01 A
Supply Current-Max 0.18 mA Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES Technology CMOS
Terminal Finish TIN SILVER COPPER Terminal Form BALL
Terminal Pitch 0.8 mm Terminal Position BOTTOM

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Packing

AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.

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