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See Technical Specifications

W949D6DBHX5E +BOM

4M x 4 x 16 configuration

Manufacturer:

WINBOND ELECTRONICS CORP
Mfr.Part #:

W949D6DBHX5E
Datasheet:

W949D6DBHX5E Datasheet (PDF)
Part Life Cycle Code:

Active
Reach Compliance Code:

compliant
ECCN Code:

EAR99
HTS Code:

8542.32.00.28
EDA/CAD Models:

Request Free CAD Models for W949D6DBHX5E

W949D6DBHX5E General Description

When it comes to integrated circuits, the W949D6DBHX5E chip stands out as a top-tier option for technology professionals. Offering an impressive combination of advanced features, low power consumption, and exceptional reliability, this chip is well-suited for demanding applications across various industries. Whether used in communication devices, industrial equipment, or automotive systems, the W949D6DBHX5E chip delivers superior performance and steadfast dependability

Key Features

2.5V ±0.2V Power Supply for DDR266/DDR333
2.6V ±0.1V Power Supply for DDR400/DDR500
Up to 250 MHz Clock Frequency
Double Data Rate architecture; two data transfers per clock cycle
Differential clock inputs (CLK and CLK )
DQS is edge-aligned with data for Read; center-aligned with data for Write
CAS Latency: 2, 2.5 and 3
Burst Length: 2, 4 and 8
Auto Refresh and Self Refresh
Precharged Power Down and Active Power Down
Write Data Mask
Write Latency = 1
7.8µS refresh interval (8K / 64 mS refresh)
Maximum burst refresh cycle: 8
Interface: SSTL_2
Packaged in TSOP II 66-pin, 400 mil, 0.65 mm pin pitch, using Pb free with RoHS compliant

Specifications

Part Life Cycle Code	Active	Reach Compliance Code	compliant
ECCN Code	EAR99	HTS Code	8542.32.00.28
Access Mode	DUAL BANK PAGE BURST	Access Time-Max	5 ns
Additional Feature	AUTO/SELF REFRESH	JESD-30 Code	R-PBGA-B60
Length	9 mm	Memory Density	536870912 bit
Memory IC Type	LPDDR1 DRAM	Memory Width	16
Number of Functions	1	Number of Ports	1
Number of Terminals	60	Number of Words	33554432 words
Number of Words Code	32000000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-25 °C
Organization	32MX16	Peak Reflow Temperature (Cel)	NOT SPECIFIED
Seated Height-Max	1.025 mm	Self Refresh	YES
Supply Voltage-Max (Vsup)	1.95 V	Supply Voltage-Min (Vsup)	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	OTHER
Terminal Form	BALL	Terminal Pitch	0.8 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Width	8 mm