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Product W971GG8JB-25 is manufactured by Winbond Electronics Corporation
FBGAManufacturer:
WINBOND ELECTRONICS CORP
Mfr.Part #:
W971GG8JB-25
Datasheet:
Part Life Cycle Code:
Active
Pin Count:
60
Reach Compliance Code:
compliant
ECCN Code:
EAR99
EDA/CAD Models:
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SDRAM - DDR2 Memory IC 1Gbit Parallel 200 MHz 57.5 ns 60-WBGA (8x12.5)
Power Supply: VDD, VDDQ = 1.8 V0.1 V
Double Data Rate architecture: two data transfers per clock cycle
CAS Latency: 3, 4, 5, 6 and 7
Burst Length: 4 and 8
Bi-directional, differential data strobes (DQS and DQS ) are transmitted / received with data
Edge-aligned with Read data and center-aligned with Write data
DLL aligns DQ and DQS transitions with clock
Differential clock inputs (CLK and CLK )
Data masks (DM) for write data.
Commands entered on each positive CLK edge, data and data mask are referenced to both edges of DQS
Posted CAS programmable additive latency supported to make command and data bus efficiency
Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
Off-Chip-Driver impedance adjustment (OCD) and On-Die-Termination (ODT) for better signal quality
Auto-precharge operation for read and write bursts
Auto Refresh and Self Refresh modes
Precharged Power Down and Active Power Down
Write Data Mask
Write Latency = Read Latency - 1 (WL = RL - 1)
Interface: SSTL_18
Packaged in WBGA 60 Ball (8x12.5 mm2), using Lead free materials with RoHS compliant
Part Life Cycle Code | Active | Pin Count | 60 |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
HTS Code | 8542.32.00.02 | Access Mode | MULTI BANK PAGE BURST |
Access Time-Max | 0.4 ns | Additional Feature | AUTO/SELF REFRESH |
Clock Frequency-Max (fCLK) | 400 MHz | I/O Type | COMMON |
Interleaved Burst Length | 4,8 | JESD-30 Code | R-PBGA-B60 |
Length | 12.5 mm | Memory Density | 134217728 bit |
Memory IC Type | DDR2 DRAM | Memory Width | 8 |
Number of Functions | 1 | Number of Ports | 1 |
Number of Terminals | 60 | Number of Words | 16777216 words |
Number of Words Code | 16000000 | Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | |
Organization | 16MX8 | Output Characteristics | 3-STATE |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | Power Supplies | 1.8 V |
Qualification Status | Not Qualified | Refresh Cycles | 8192 |
Seated Height-Max | 1.2 mm | Self Refresh | YES |
Sequential Burst Length | 4,8 | Supply Current-Max | 0.18 mA |
Supply Voltage-Max (Vsup) | 1.9 V | Supply Voltage-Min (Vsup) | 1.7 V |
Supply Voltage-Nom (Vsup) | 1.8 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | OTHER |
Terminal Form | BALL | Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 8 mm |
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