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W971GG8JB-25 +BOM

Product W971GG8JB-25 is manufactured by Winbond Electronics Corporation

W971GG8JB-25 General Description

SDRAM - DDR2 Memory IC 1Gbit Parallel 200 MHz 57.5 ns 60-WBGA (8x12.5)

Key Features

Power Supply: VDD, VDDQ = 1.8 V0.1 V

Double Data Rate architecture: two data transfers per clock cycle

CAS Latency: 3, 4, 5, 6 and 7

Burst Length: 4 and 8

Bi-directional, differential data strobes (DQS and DQS ) are transmitted / received with data

Edge-aligned with Read data and center-aligned with Write data

DLL aligns DQ and DQS transitions with clock

Differential clock inputs (CLK and CLK )

Data masks (DM) for write data.

Commands entered on each positive CLK edge, data and data mask are referenced to both edges of DQS

Posted CAS programmable additive latency supported to make command and data bus efficiency

Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)

Off-Chip-Driver impedance adjustment (OCD) and On-Die-Termination (ODT) for better signal quality

Auto-precharge operation for read and write bursts

Auto Refresh and Self Refresh modes

Precharged Power Down and Active Power Down

Write Data Mask

Write Latency = Read Latency - 1 (WL = RL - 1)

Interface: SSTL_18

Packaged in WBGA 60 Ball (8x12.5 mm2), using Lead free materials with RoHS compliant

Specifications

Part Life Cycle Code Active Pin Count 60
Reach Compliance Code compliant ECCN Code EAR99
HTS Code 8542.32.00.02 Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.4 ns Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 400 MHz I/O Type COMMON
Interleaved Burst Length 4,8 JESD-30 Code R-PBGA-B60
Length 12.5 mm Memory Density 134217728 bit
Memory IC Type DDR2 DRAM Memory Width 8
Number of Functions 1 Number of Ports 1
Number of Terminals 60 Number of Words 16777216 words
Number of Words Code 16000000 Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C Operating Temperature-Min
Organization 16MX8 Output Characteristics 3-STATE
Peak Reflow Temperature (Cel) NOT SPECIFIED Power Supplies 1.8 V
Qualification Status Not Qualified Refresh Cycles 8192
Seated Height-Max 1.2 mm Self Refresh YES
Sequential Burst Length 4,8 Supply Current-Max 0.18 mA
Supply Voltage-Max (Vsup) 1.9 V Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V Surface Mount YES
Technology CMOS Temperature Grade OTHER
Terminal Form BALL Terminal Pitch 0.8 mm
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8 mm

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