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Trans IGBT Module
MODULEManufacturer:
Mfr.Part #:
2MBI300HJ-120-50
Datasheet:
Part Life Cycle Code:
Active
ECCN Code:
EAR99
Case Connection:
ISOLATED
Collector Current-Max (IC):
370 A
EDA/CAD Models:
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Avaq Semiconductor offers the highly versatile and reliable 2MBI300HJ-120-50 driver, produced by FUJITSU. With its multifunctional and high-performance capabilities, this component is an excellent choice for a wide range of electronic projects.
To ensure that you have all the necessary information to make the most of this component, Avaq provides a free datasheet PDF, as well as circuit diagrams, pin layouts, pin details, pin voltage ratings, and equivalent components for the 2MBI300HJ-120-50.
Avaq also offers free samples. Simply fill out and submit the sample request form to receive your free samples for testing. If you have any questions, please feel free to contact us at any time.
Part Life Cycle Code | Active | Reach Compliance Code | |
ECCN Code | EAR99 | Case Connection | ISOLATED |
Collector Current-Max (IC) | 370 A | Collector-Emitter Voltage-Max | 1200 V |
Configuration | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE | Gate-Emitter Thr Voltage-Max | 6.7 V |
Gate-Emitter Voltage-Max | 20 V | JESD-30 Code | R-XUFM-X7 |
Number of Elements | 2 | Number of Terminals | 7 |
Operating Temperature-Max | 150 °C | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Polarity/Channel Type | N-CHANNEL | Surface Mount | NO |
Terminal Form | UNSPECIFIED | Terminal Position | UPPER |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | Transistor Element Material | SILICON |
Turn-off Time-Nom (toff) | 350 ns | Turn-on Time-Nom (ton) | 430 ns |
VCEsat-Max | 3.7 V |
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AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.
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Qty. | Unit Price | Ext. Price |
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The prices below are for reference only.
All bill of materials (BOM) can be sent via email to
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or fill below form to Quote for 2MBI300HJ-120-50, guaranteed quotes back within
12hr.
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