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IXYP20N65C3D1 +BOM

Silicon Insulated Gate Bipolar Transistor semiconductor chip designed for high power applications

IXYP20N65C3D1 General Description

IGBT PT 650 V 50 A 200 W Through Hole TO-220-3

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Key Features

  • Optimized for 20-60kHz Switching
  • Plastic Overmolded Tab for Electrical Isolation
  • Square RBSOA
  • Avalanche Rated
  • Anti-Parallel Fast Diode
  • Short Circuit Capability
  • Advantages
  • High Power Density
  • Extremely Rugged
  • Low Gate Drive Requirement

Specifications

Part Life Cycle Code Active Reach Compliance Code
ECCN Code EAR99 Case Connection COLLECTOR
Collector Current-Max (IC) 50 A Collector-Emitter Voltage-Max 650 V
Configuration SINGLE WITH BUILT-IN DIODE Gate-Emitter Thr Voltage-Max 6 V
Gate-Emitter Voltage-Max 20 V JEDEC-95 Code TO-220AB
JESD-30 Code R-PSFM-T3 Number of Elements 1
Number of Terminals 3 Operating Temperature-Max 175 °C
Operating Temperature-Min -55 °C Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 200 W Surface Mount NO
Terminal Form THROUGH-HOLE Terminal Position SINGLE
Transistor Application POWER CONTROL Transistor Element Material SILICON
Turn-off Time-Nom (toff) 132 ns Turn-on Time-Nom (ton) 51 ns
VCEsat-Max 2.5 V Series GenX3™, XPT™
IGBT Type PT Voltage - Collector Emitter Breakdown (Max) 650 V
Current - Collector (Ic) (Max) 50 A Current - Collector Pulsed (Icm) 105 A
Vce(on) (Max) @ Vge, Ic 2.5V @ 15V, 20A Power - Max 200 W
Switching Energy 430µJ (on), 350µJ (off) Input Type Standard
Gate Charge 30 nC Td (on/off) @ 25°C 19ns/80ns
Test Condition 400V, 20A, 20Ohm, 15V Reverse Recovery Time (trr) 135 ns
Operating Temperature -55°C ~ 175°C (TJ) Mounting Type Through Hole
Base Product Number IXYP20

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