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See Technical Specifications

RC28F128J3D75A +BOM

Parallel NOR Flash Chip 3V/3.3V 128 Megabit 16M x 8/8M x 16 75ns 64-Pin EZBGA Tray

Manufacturer:

Micron Technology Inc.
Mfr.Part #:

RC28F128J3D75A
Datasheet:

RC28F128J3D75A Datasheet (PDF)
Part Life Cycle Code:

Obsolete
ECCN Code:

EAR99
HTS Code:

8542.32.00.51
Access Time-Max:

75 ns
EDA/CAD Models:

Request Free CAD Models for RC28F128J3D75A

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RC28F128J3D75A General Description

The RC28F128J3D75A stands out for its seamless integration of advanced features, ensuring that data remains secure and the chip remains operational even in extreme conditions. Its efficient design and performance capabilities make it a go-to solution for manufacturers looking to incorporate cutting-edge flash memory technology into their devices

Specifications

Part Life Cycle Code	Obsolete	Reach Compliance Code
ECCN Code	EAR99	HTS Code	8542.32.00.51
Access Time-Max	75 ns	Alternate Memory Width	8
Command User Interface	YES	Common Flash Interface	YES
Data Polling	NO	JESD-30 Code	S-PBGA-B64
Memory Density	134217728 bit	Memory IC Type	FLASH
Memory Width	16	Number of Sectors/Size	128
Number of Terminals	64	Number of Words	8388608 words
Number of Words Code	8000000	Operating Temperature-Max	85 °C
Operating Temperature-Min	-40 °C	Organization	8MX16
Page Size	4/8 words	Parallel/Serial	PARALLEL
Peak Reflow Temperature (Cel)	235	Qualification Status	Not Qualified
Ready/Busy	YES	Sector Size	128K
Standby Current-Max	0.00012 A	Supply Current-Max	0.08 mA
Surface Mount	YES	Technology	CMOS
Temperature Grade	INDUSTRIAL	Terminal Form	BALL
Terminal Pitch	1 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	Toggle Bit	NO
Type	NOR TYPE