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See Technical Specifications

RC28F00AP30TFA +BOM

RoHS-compliant NOR flash memory module with an EASYBGA-64(8x10) package featuring 64 pins

Manufacturer:

MICRON TECHNOLOGY INC
Mfr.Part #:

RC28F00AP30TFA
Datasheet:

RC28F00AP30TFA Datasheet (PDF)
Pbfree Code:

No
Part Life Cycle Code:

Obsolete
Pin Count:

64
ECCN Code:

EAR99
EDA/CAD Models:

Request Free CAD Models for RC28F00AP30TFA

RC28F00AP30TFA General Description

Furthermore, with integrated error correction mechanisms and wear-leveling algorithms, data integrity remains sacrosanct, while the component's longevity is bolstered, epitomizing Intel's unwavering dedication to reliability and resilience

Key Features

Architecture
— Symmetrical 128-Kbyte blocks
— 256 Mbit (256 blocks)
— 128 Mbit (128 blocks)
— 64 Mbit (64 blocks)
— 32 Mbit (32 blocks)
Performance
— 75 ns Initial Access Speed (32,64,128 Mbit densities)
— 95 ns Initial Access Speed (256Mbit only)
— 25 ns 8-word and 4-word Asynchronous page-mode reads
— 32-Byte Write buffer; 4 µs per Byte Effective programming time
System Voltage
— VCC = 2.7 V to 3.6 V
— VCCQ = 2.7 V to 3.6 V
Packaging
— 56-Lead TSOP (32, 64, 128, 256 Mbit)
— 64-Ball Numonyx Easy BGA package (32, 64, 128 and 256 Mbit)
Security
— Enhanced security options for code protection
— 128-bit Protection Register: 64-bits Unique device identifier bits 64-bits User-programmable OTP bits
— Absolute protection with VPEN = GND
— Individual block locking
— Block erase/program lockout during power transitions
Software
— Program and erase suspend support
— Flash Data Integrator (FDI), Common Flash Interface (CFI) Compatible
Quality and Reliability
— Operating temperature: -40 °C to +85 °C
— 100K Minimum erase cycles per block
— 0.13 µm ETOX™ VIII Process technology

Specifications

Pbfree Code	No	Part Life Cycle Code	Obsolete
Pin Count	64	Reach Compliance Code
ECCN Code	EAR99	HTS Code	8542.32.00.51
Access Time-Max	100 ns	Additional Feature	TOP BOOT
Boot Block	TOP	Command User Interface	YES
Common Flash Interface	YES	Data Polling	NO
JESD-30 Code	R-PBGA-B64	JESD-609 Code	e1
Length	10 mm	Memory Density	1073741824 bit
Memory IC Type	FLASH	Memory Width	16
Number of Functions	1	Number of Sectors/Size	4,1023
Number of Terminals	64	Number of Words	67108864 words
Number of Words Code	64000000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	64MX16	Page Size	16 words
Parallel/Serial	PARALLEL	Peak Reflow Temperature (Cel)	235
Power Supplies	1.8,1.8/3.3 V	Programming Voltage	3 V
Qualification Status	Not Qualified	Seated Height-Max	1.2 mm
Sector Size	16K,64K	Standby Current-Max	0.00024 A
Supply Current-Max	0.031 mA	Supply Voltage-Max (Vsup)	2 V
Supply Voltage-Min (Vsup)	1.7 V	Supply Voltage-Nom (Vsup)	1.8 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	INDUSTRIAL	Terminal Finish	TIN SILVER COPPER
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
Toggle Bit	NO	Type	NOR TYPE
Width	8 mm