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See Technical Specifications

THGAMRG9T23BAIL +BOM

512G-bit TLC NAND Flash Serial e-MMC with 153-Pin FBGA

Manufacturer:

Kioxia
Mfr.Part #:

THGAMRG9T23BAIL
Datasheet:

THGAMRG9T23BAIL Datasheet (PDF)
Series:

THGAM
Memory Size:

64 GB
Configuration:

TLC
Supply Voltage - Min:

2.7 V
EDA/CAD Models:

Request Free CAD Models for THGAMRG9T23BAIL

THGAMRG9T23BAIL General Description

Toshiba's THGAMRG9T23BAIL chip is not only powerful in terms of performance but also compact and adaptable. Its BGA package ensures reliable integration into a wide array of electronic devices, while its compatibility with standard NAND flash interfaces makes it a versatile option for product developers across various industries. Whether it's for consumer electronics, enterprise storage systems, or industrial applications, the THGAMRG9T23BAIL chip offers a mix of capacity, speed, and ease of integration that is hard to beat

Specifications

Product Category	eMMC	Series	THGAM
Memory Size	64 GB	Configuration	TLC
Supply Voltage - Min	2.7 V	Supply Voltage - Max	3.6 V
Minimum Operating Temperature	- 25 C	Maximum Operating Temperature	+ 85 C
Moisture Sensitive	Yes	Mounting Style	SMD/SMT
Product	eMMC Flash Drive	Product Type	eMMC
Factory Pack Quantity	152	Subcategory	Memory & Data Storage
Unit Weight	0.005997 oz	Part Life Cycle Code	Obsolete
Reach Compliance Code		ECCN Code	EAR99
HTS Code	8542.32.00.51	JESD-30 Code	R-PBGA-B153
Length	13 mm	Memory Density	549755813888 bit
Memory IC Type	Embedded MMC	Memory Width	8
Number of Functions	1	Number of Terminals	153
Number of Words	68719476736 words	Number of Words Code	64000000000
Operating Mode	ASYNCHRONOUS	Operating Temperature-Max	85 °C
Operating Temperature-Min	-25 °C	Organization	64GX8
Seated Height-Max	0.8 mm	Supply Voltage-Max (Vsup)	3.6 V
Supply Voltage-Min (Vsup)	2.7 V	Supply Voltage-Nom (Vsup)	3.3 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	OTHER	Terminal Form	BALL
Terminal Pitch	0.5 mm	Terminal Position	BOTTOM
Type	NAND TYPE	Width	11 mm